Process for producing graphite film and graphite film produced thereby

ABSTRACT

In order to obtain a graphite film having an excellent thermal diffusivity, a high density, and excellent flatness without flaws, recesses and wrinkles on the surface, the process for producing a graphite film according to the present invention comprises the graphitization step for a raw material film made of a polymer film and/or a carbonized polymer film and/or the post-planar pressurization step for the film in this order to prepare a graphite film, wherein the graphitization step is a step of thermally treating two or more stacked raw material films at a highest temperature of 2,000° C. and includes a method of electrically heating the raw material films themselves and/or a method of thermally treating the films while applying pressure to the films planarly, and the post-planar pressurization step includes a method of planarly pressurizing the one raw material film or the multiple stacked raw material films after graphitization by single-plate press or vacuum press.

This application is a Divisional of co-pending application Ser. No.11/921,261 for which priority is claimed under 35 U.S.C. §120, which isthe national phase of PCT International Application No.PCT/JP2006/310724 filed on May 30, 2006 under 35 U.S.C. §371. The entirecontents of each of the above-identified applications are herebyincorporated by reference.

TECHNICAL FIELD

The present invention relates to a process for producing a graphite filmused as a heat radiation film, and a graphite film produced by theprocess.

BACKGROUND ART

Patent Document 1 describes, as a process for providing a graphite filmhaving excellent electrical conductivity and thermal conductivity, “aprocess for producing a graphite film and fiber comprising graphitizingat least one polymer film or fiber selected from polyoxadiazole,polybenzothiazole, polybenzobisthiazole, polybenzoxazole,polybenzobisoxazole and polythiazole by thermally treating the polymerfilm or fiber at a temperature of 400 to 700° C. under vacuum or in aninert gas with tension applied thereto and then thermally treating thepolymer film or fiber at a temperature of 1,600° C. or more under vacuumor in an inert gas”, which is a so-called polymer pyrolysis process.Patent Document 2 also describes a so-called polymer pyrolysis process.

Patent Document 3 describes “a process for producing a graphitecomprising thermally treating aromatic polyimide at a temperature of2,200° C. or more and pressure bonding the resulting multiplecarbonaceous films in a temperature region of 1,600° C. or more with apressure of 4 kg/cm² or more applied to the films”.

A process for producing a graphite comprising burning a kneaded productmade of carbon raw material powder such as coke and a caking additivesuch as tar pitch and then electrically heating the burned product(Patent Document 4) is known as a process for producing a large quantityand volume of a graphite having inferior electrical conductivity andthermal conductivity but used for a bearing, seal, crucible, heatingelement or the like with high productivity.

Further, a process for producing a film-like graphite comprisingthermally treating at a temperature of 2,400° C. or more a polymer filmhaving a thickness enough to provide a graphite film by generation ofgas from the film by heating at normal pressure; and rolling theresulting graphite film (Patent Document 2) is known as a process forproducing an excellent film-like graphite having high flexibility andtoughness.

-   Patent Document 1: Japanese Patent Laid-Open No. 61-275116-   Patent Document 2: Japanese Patent No. 2976481-   Patent Document 3: Japanese Patent Laid-Open No. 64-56364-   Patent Document 4: Japanese Patent Laid-Open No. 5-78111

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

The present invention has been achieved in view of the above-describedcircumstances. An object of the present invention is to provide agraphite film that has an excellent thermal diffusivity, has a highdensity, and has excellent flatness without flaws, recesses and wrinkleson the surface.

Specifically, a graphite obtained by heating a polymer filmatmospherically or under reduced pressure in the conventional art(Patent Documents 1 to 3) does not have sufficient thermal conductivityand is not sufficient as a heat radiation material for electronicequipment in recent years generating a drastically increased amount ofheat.

This is presumably because, in the polymer pyrolysis process byatmospheric heating of the conventional art, a raw material film isheated from the surface and is non-uniformly graphitized between theinside and the surface of the film, and thus the film as a whole hasreduced thermal conductivity.

A graphite may be thicker to increase the amount of heat transport inorder to increase heat radiation properties. However, in theconventional polymer pyrolysis process, a film is easily broken, or onlya graphite with low thermal conductivity can be obtained if the film isnot broken. Specifically, in the conventional polymer pyrolysis processsuch as “a process for producing a film-like graphite comprisingthermally treating at a temperature of 2,400° C. or more a polymer filmhaving a thickness enough to provide a graphite film by generation ofgas from the film by heating at normal pressure; and rolling theresulting graphite film” described in claim 1 of Patent Document 2, “aprocess for producing a film-like graphite comprising thermally treatinga polymer film having a thickness of 75 um or less at a temperature of2,400° C. or more; and rolling the resulting graphite film” described inclaim 2 of Patent Document 2, or “a process for producing a film-likegraphite comprising thermally treating a polymer film having a thicknessof more than 75 um and 400 um or less at a temperature of 2,400° C. ormore in a pressurized state”, when a raw material film is thick, inparticular, the film is graphitized from the surface in the middle ofthe graphitization step, making it difficult to release decompositiongas from the outside, and forced release of decomposition gas makes thefilm easily broken or only provides a graphite having low thermalconductivity if the film is not broken. The “pressurized state” in claim3 of the aforementioned Patent Document 2 refers to, according to thedescription in the specification of Patent Document 2, a state where theatmosphere is pressurized from normal pressure to 0.2 kg/cm² or 1.0kg/cm², for example, in “thermal treatment under isotropicpressurization conditions”. According to the description, it is “notappropriate to use a method of applying pressure” to a raw material filmanisotropically “only in the direction of a jig made of graphite or thelike to hold the raw material film, such as hot press”. The polymerpyrolysis process by heating under reduced pressure reduces thermalconductivity.

In particular, when the raw material film is thick, the film isgraphitized from the surface, making it difficult to releasedecomposition gas from the inside, and the film is broken by forcedrelease of decomposition gas. Even if the film is not broken, the filmis not sufficiently internally graphitized unlike the case where thefilm is thin, and thermal conductivity is extremely inferior.

Further, it is possible to employ a process for producing a large numberof graphite films comprising heating a plurality of stacked carbonaceousfilms atmospherically or under reduced pressure. However, in such aprocess, heat is non-uniformly transferred to the stacked films, andthus the stacked films are non-uniformly graphitized and may haveinferior thermal conductivity. Wrinkles and cracks may be generated inthe many treated films. The specification of Patent Document 2 describesthat “it is not appropriate to use a method of applying pressure to araw material film only in the direction of a jig made of graphite or thelike to hold the raw material film, such as hot press; this is becausefree extension and shrinkage of the film itself are prevented and thegenerated gas breaks graphite crystallites.” This means that it is notpreferable to apply pressure in the thickness direction of the filmduring thermal treatment in the conventional art. The specification ofPatent Document 2 describes that “the pressure applied must beisotropic”, meaning that isotropic pressurization is preferable in theconventional art.

Further, as described in Example 1 of Patent Document 3, “a carbonaceousfilm obtained by thermal treatment at 2,000° C. or less could not be hotpressed due to the cracks generated in the film”. This means thatsingle-layer thermal diffusion films could not be produced by thermallytreating a plurality of stacked carbonaceous films to which pressure wasapplied, because the carbonaceous films were pressure bonded or brokenin the graphitization step. When the films were forcibly peeled off, theadhered parts were broken.

Patent Document 4 describes a graphitization method of burning a mixturemade of carbon raw material powder and a caking additive andelectrically heating the burned product. However, since such a burnedproduct of a mixture containing a caking additive is used as a rawmaterial in the conventional method, current flowing in the burnedproduct is biased due to non-uniform conductivity of the burned product.Therefore, the temperature is locally increased, graphitizationnon-uniformly occurs, and the burned product has cracks and is easilybroken. As a result, the graphite obtained by such a conventionalelectrical heating method has thermal conductivity and electricalconductivity extremely inferior to those of a graphite film obtained bythermally treating a polymer film by a conventional method. Inparticular, it is difficult to obtain a plurality of graphites at thesame time with high quality in a stable manner, disadvantageously,because the position of the materials to be treated is deviated duringheating. In order to prevent this disadvantage, there has been proposeda method of bonding the burned products with an adhesive and thenelectrically heating the products. However, in this method, graphitescan be obtained without cracks but have extremely inferior thermalconductivity and electrical conductivity.

Patent Document 2 describes a method of further rolling a graphite filmobtained by thermally treating a polymer film at a high temperaturethrough two rollers made of ceramic or stainless steel. However, in thismethod, the graphite film to be rolled does not have sufficientstrength. Therefore, when pressure is linearly applied to the part ofthe graphite film in contact with the rollers during rolling treatment,the graphite film is extended, the planarly formed graphite layer isbroken, and thus thermal conductivity is reduced, disadvantageously.Moreover, the density varies among different parts or the density isreduced, so that thermal diffusivity varies, and thermal diffusivity isreduced because the film contains a large amount of an air layer,disadvantageously. Further, flaws or wrinkles are easily generated andrecesses and longitudinal stripes are generated on the surface of thegraphite film when the film is rolled through a roller having highstrength such as a metal roller, disadvantageously. Such recesses andlongitudinal stripes cause deterioration in contact of the graphite filmwith a heat generation component or heat radiation component, and thusare huge problems for applications making use of the excellent thermaldiffusivity of the graphite.

Further, Patent Document 3 describes a process for producing an integralfilm-like graphite comprising pressure bonding a plurality of film-likegraphites by hot press in a temperature region of 1,600° C. or more witha pressure of 4 kg/cm² or more applied to the graphites. However, it isdifficult to recover film-like graphites obtained in this manner asseparate multiple film-like graphites with no damage.

Means for Solving the Problems

The process for producing a graphite film according to the presentinvention comprises the step of graphitizing a raw material film made ofa polymer film and/or a carbonized polymer film by retaining the film inand in contact with a container that can be directly electrified byapplication of voltage and electrifying the container by application ofvoltage. Electric resistance is reduced as graphitization proceeds.Accordingly, current flows in the whole film. As a result, the film iseasily graphitized and uniformly heated due to contribution of heatgeneration of the raw material film itself by Joule heat. Thus, anexcellent graphite film having excellent thermal conductivity can beobtained without breakage, cracks and wrinkles.

In particular, when a carbonaceous polymer film is used as the rawmaterial film, even if the process comprises the step of graphitizingtwo or more such films stacked to which pressure is applied, a largenumber of graphite films having an excellent thermal diffusivity andexcellent flatness can be obtained without breakage and adhesion.

The graphitization step preferably includes thermal treatment at atemperature of 2,000° C. or more. This can provide a graphite withexcellent thermal conductivity.

The container that can be directly electrified by application of voltageis preferably a graphite container, because such a container iselectrically heated to a temperature region of 2,500° C. and is easilyhandled and highly industrially available, for example.

The graphitization step is preferably carried out with carbon powderpacked between the graphite container and the raw material film and/oron the outer periphery of the graphite container. The raw material filmis more uniformly electrified and heated.

The graphitization step is preferably carried out with pressure appliedto the raw material film planarly. Since carbon rearrangement is easilydirected in the plane direction of the film in the graphitizationprocess, an excellent graphite film having excellent flatness and highcrystallinity can be obtained.

The pressure is preferably reduced in part of the graphitization step.This can prevent application of excessive pressure to the film, and agraphite film having excellent flatness and thermal conductivity can beobtained without breakage, adhesion, cracks and wrinkles.

The graphitization step is preferably carried out in the state where thetwo or more raw material films are stacked. Electric resistance isreduced as graphitization proceeds as described above. Accordingly,current flows in the whole stacked films. As a result, the stacked filmsare uniformly heated due to contribution of heat generation of thestacked raw material films themselves. Thus, graphite films can beobtained without breakage, cracks and wrinkles.

More preferably, the number of the stacked films is 10 in the statewhere the two or more raw material films are stacked.

The graphitization step is preferably carried out in the state where thetwo or more raw material films are stacked and a carbon material havinga height smaller than the height of the stacked films is present aroundthe stacked films. It is possible to apply planar pressure to the rawmaterial films only corresponding to the height of the carbon materialby a graphite jig used for holding the raw material films, for example.Thus, adhesion of the films to each other can be prevented.

The process preferably further comprises the post-planar pressurizationstep of pressurizing the graphitized raw material film planarly afterthe graphitization step. Since planar pressure is uniformly applied tothe graphite film, the graphite layer is compressed without breakage andthe thermal diffusivity is not reduced. Therefore, a graphite film canbe obtained having a high thermal diffusivity, a high density, andexcellent flatness without flaws, recesses and wrinkles on the surface.In particular, when the electrical heating method is used in thegraphitization step, the graphite layer is planarly developed.Therefore, the post-planar pressurization step can provide a graphitefilm having a more excellent thermal diffusivity, a high density, andexcellent flatness without flaws, recesses and wrinkles on the surface.

The pressurization is preferably carried out by single-plate press inthe post-planar pressurization step. Since planar pressure can beuniformly applied to the graphite film, the graphite layer is compressedwithout breakage and the thermal diffusivity is not reduced. Therefore,a graphite film can be obtained having a high thermal diffusivity and ahigh density and having no flaws and wrinkles on the surface.

The pressurization is more preferably carried out by vacuum press in thepost-planar pressurization step. Since the graphite film is pressurizedunder reduced pressure, the air layer contained in the graphite layer iscompressed, the graphite layer is compressed without breakage, and thethermal diffusivity is not reduced. Therefore, a graphite film having ahigh thermal diffusivity and a high density can be obtained.

The graphitized raw material film is preferably pressurized togetherwith a film-like medium other than the graphitized raw material film inthe post-planar pressurization step.

The multiple graphitized raw material films are preferablysimultaneously pressurized in the post-planar pressurization step. Sincethe graphite films themselves function as cushioning materials, graphitefilms can be obtained having more excellent flatness without flaws onthe surface.

The process preferably further comprises the independent recovery stepof recovering the multiple graphitized raw material films planarlypressurized as independent graphite films after the post-planarpressurization step. Graphite films can be obtained having a highdiffusivity, a high density, and excellent flatness without flaws,recesses and wrinkles on the surface.

The carbonized polymer film is preferably obtained by the carbonizationstep of thermally treating a polymer film at a temperature of 600 to1,800° C. Even the stacked graphitized raw material films are difficultto be adhered to each other during thermal treatment, and it is possibleto prevent deviation of the position of the raw material films due todecomposition gas or deformation of the raw material films in thegraphitization step. Thus, wrinkles and cracks of the resulting filmscan be prevented.

The polymer film is preferably made of one or more polymers selectedfrom polyimide, polyamide, polyoxadiazole, polybenzothiazole,polybenzobisthiazole, polybenzoxazole, polybenzobisoxazole,poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole andpolythiazole. This makes it possible to increase electrical conductivityand thermal conductivity of the final graphite film.

The polymer film is particularly preferably a polyimide film. Filmshaving various structures and properties can be obtained by selecting araw material monomer from various monomers.

The polyimide film preferably has a birefringence of 0.08 or more. Sincethe film is easily carbonized and graphitized, the resulting graphitefilm easily has increased electrical conductivity. More particularlypreferably, the polyimide film has a birefringence of 0.12 or more.

The polyimide film is preferably prepared by imidizing a polyamide acidcontaining pyromellitic acid dianhydride and p-phenylenediamine using adehydrating agent and an imidization promoter, because such a polyimidefilm has a high birefringence.

The polyimide film is particularly preferably prepared by synthesizing aprepolymer having an acid dianhydride at each terminal from a diamineand the acid dianhydride; synthesizing a polyamide acid by reaction ofthe prepolymer with a diamine differing from the diamine; and imidizingthe polyamide acid, because the resulting polyimide film has a highbirefringence and a low coefficient of linear expansion.

A graphite film produced by the process for producing a graphite filmaccording to the present invention preferably has a coefficient oflinear expansion of 0 ppm or less.

Such a graphite film of the present invention preferably has a tensilemodulus of elasticity of 1 GPa or more.

Such a graphite film of the present invention preferably has a thermalconductivity in the contact thickness direction of 1.4 W/m·K or lessmeasured by a thermal resistance measuring apparatus.

Such a graphite film of the present invention preferably has a tensilestrength of 25 MPa or more.

Such a graphite film of the present invention preferably has a thermaldiffusivity in the plane direction of 9.0×10⁻⁴ m²/s or more.

Such a graphite film of the present invention preferably has a densityof 1.5 g/cm³ or more.

Such a graphite film of the present invention preferably has a variationin thickness of 10 μm or less.

Such a graphite film of the present invention preferably has across-sectional structure having a part in which a surface layer and alayer other than the surface layer differ at least in cross-sectionalpattern.

Effects of the Invention

The process for producing a graphite film according to the presentinvention comprises the step of graphitizing a raw material film made ofa polymer film and/or a carbonized polymer film by retaining the film inand in contact with a container that can be directly electrified byapplication of voltage and electrifying the container by application ofvoltage. Electric resistance is reduced as graphitization proceeds.Accordingly, current flows in the whole film. As a result, the film iseasily graphitized and uniformly heated due to contribution of heatgeneration of the raw material film itself by Joule heat. Thus, anexcellent graphite film having excellent thermal conductivity can beobtained without breakage, cracks and wrinkles.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a method of retaining a container A in a container B;

FIG. 2 shows a method of retaining a container A in a container B;

FIG. 3 shows a method of retaining a container A in a container B;

FIG. 4 shows a method of electrifying a container A and a container B;

FIG. 5 shows a method of electrifying a container A and a container B;

FIG. 6 shows a polyimide film and a wedge-shaped sheet;

FIG. 7 is an oblique view of a wedge-shaped sheet;

FIG. 8 shows a graphite container used for contacting and retaining araw material film. The pressure planarly applied to the raw materialfilm is reduced in part of the graphitization step;

FIG. 9 shows a graphite jig used for contacting and retaining a rawmaterial film. The pressure planarly applied to the raw material film isnot reduced in the graphitization step;

FIG. 10 is a cross-sectional SEM image of a graphite film of Example 5;and

FIG. 11 is a cross-sectional SEM image of a graphite film of ComparativeExample 7.

DESCRIPTION OF THE REFERENCE SIGNS

-   1 Polyimide film-   2 Wedge-shaped sheet-   3 Width of wedge-shaped sheet-   4 Sodium light-   5 Interference fringes-   11 Smooth and electrifiable flat plate for contacting and retaining    a raw material film-   13 Container A contacting and retaining a raw material film-   21 Cylindrical container B-   31 Carbon particles packed between the container A and the container    B-   32 Carbon particles packed around the outer periphery of the    container B-   41 Graphite container for contacting and retaining a raw material    film-   42 Stacked raw material films-   43 Graphite lid of the graphite container-   44 Graphite screw for fixing the lid of the graphite container-   45 Graphite bolt-   46 Graphite nut-   47 Smooth flat graphite plate

BEST MODES FOR CARRYING OUT THE INVENTION <Raw Material Film>

The raw material film that can be used in the present invention is apolymer film or a carbonized polymer film.

<Polymer Film>

Examples of the material for the polymer film that can be used in thepresent invention include polyimide (PI), polyamide (PA), polyoxadiazole(POD), polybenzothiazole (PBT), polybenzobisthiazole (PBBT),polybenzoxazole (PBO), polybenzobisoxazole (PBBO), poly(p-phenylenevinylene) (PPV), polyphenylenebenzimidazole (PBI),polyphenylenebenzobisimidazole (PBBI) and polythiazole (PT). Thematerial is preferably a heat-resistant aromatic polymer film includingat least one of these polymers, because the final graphite has highelectrical conductivity and thermal conductivity. The film can beproduced by a known production process. Among these materials, polyimideis preferable, because films having various structures and propertiescan be obtained by selecting a raw material monomer from variousmonomers.

<Polyimide Film>

Since a polyimide film is more easily carbonized and graphitized than araw material film having another organic material as a raw material,electrical conductivity of the film at low temperatures tends to beuniformly high and electrical conductivity itself also tends to be high.As a result, in the case of graphitizing the raw material film byretaining the film in a container that can be directly electrified byapplication of voltage, with the film brought into contact with the wallsurface of the container, and electrifying the container by applicationof voltage, current uniformly flows in the film part as carbonizationproceeds, and heat is uniformly generated on the surface and in theinside of the film. Therefore, a graphite having high thermalconductivity can be provided not only when the film is thin but alsowhen the film is thick. Further, since the resulting graphite hasexcellent crystallinity and thermal resistance, the graphite is notbroken even if locally heated by concentration of the electric field,and thus has high quality.

<Polyimide Film and Birefringence>

With regard to in-plane orientation of molecules, the polyimide filmused in the present invention has a birefringence Δn in any in-planedirection of the film of 0.08 or more, preferably 0.10 or more, morepreferably 0.12 or more, and most preferably 0.14 or more.

<Raw Material Film and Birefringence>

The film is more easily carbonized and graphitized as the film has ahigher birefringence. Therefore, the film tends to have high electricalconductivity. As a result, in the step of graphitizing the raw materialfilm by retaining the film in a container that can be directlyelectrified by application of voltage, with the film brought intocontact with the wall surface of the container, and electrifying thecontainer by application of voltage, current uniformly flows in the filmas electric resistance is changed in accordance with the progression ofcarbonization. Further, as the film is carbonized, the amount of currentflowing in the film is increased, and heat is uniformly generated on thesurface and in the inside of the film. Therefore, the film is easilyuniformly graphitized. Moreover, since electrical conductivity isuniformly increased in the plane of the film, partial electric fieldconcentration does not occur and local heat generation does not occur inthe film. As a result, the surface and the inside of the film areuniformly graphitized.

Since the film is carbonized and graphitized at low temperatures, thefilm has high electrical conductivity even in the middle oflow-temperature thermal treatment. Heat is uniformly generated on thesurface and in the inside of the film, and the film is easily uniformlygraphitized.

Further, as the birefringence is higher, the graphite has more excellentcrystallinity and thermal resistance. Therefore, the graphite is notbroken even if locally heated by concentration of the electric field,and thus has high quality.

Even if the raw material is thick, a graphite having excellent thermalconductivity can be obtained, since the surface and the inside of thematerial are uniformly graphitized.

As the birefringence is higher, the resulting graphite film has thermalconductivity significantly improved. Accordingly, it is possible toreduce the highest treatment temperature for the raw material filmresulting from heat generated by electrification, and thus powerconsumption can be reduced. Even thermal treatment in a short time canprovide a graphite film with high quality.

It is not clear why the polyimide film is easily graphitized as the filmhas a high birefringence. Molecules need to be rearranged forgraphitization, and molecular rearrangement can be minimized in apolyimide film that has a high birefringence and excellent molecularorientation. Therefore, it is assumed that when a polyimide film havingmore excellent orientation is treated at a relatively low highesttreatment temperature due to heat generation by electrificationtreatment, a graphite film can be produced with higher crystallinityeven if the graphite film is thick.

<Birefringence>

The birefringence herein refers to a difference between a refractiveindex in any in-plane direction of a film and a refractive index in thethickness direction of the film. The birefringence Δnx in any in-planedirection of a film is provided by the following formula 1.

[Formula 1]

Birefringence Δnx=(Refractive index in the in-plane X directionNx)−(Refractive index in the thickness direction Nz)  (1)

A specific method of measuring the birefringence is illustrated in FIGS.1 and 2. In a plan view of FIG. 1, a thin wedge-shaped sheet 2 is cutoff from a film 1 as a measurement sample. The wedge-shaped sheet 2 hasa shape of an elongated trapezoid with one hypotenuse, and one basicangle of the sheet is a right angle. Here, the base of the trapezoid iscut off parallel to the X direction. FIG. 2 is an oblique view of themeasurement sample 2 cut off in this manner. When the cut-offcross-section corresponding to the hypotenuse of the trapezoid sample 2is irradiated with sodium light 4 at a right angle and the sample isobserved using a polarization microscope from the cut-off cross-sectioncorresponding to the hypotenuse of the trapezoid sample 2, interferencefringes 5 are observed. The birefringence Δnx in the in-plane Xdirection of the film, in which n is the number of interference fringes,is represented by the following formula 2:

[Formula 2]

Δnx=n×λ/d  (2)

wherein λ is a wavelength of a sodium D line of 589 nm, and d is a width3 of the sample 2 corresponding to the height of the trapezoid of thesample.

The aforementioned term “any in-plane direction X of the film” refers toany of the 0° direction, 45° direction, 90° direction and 135° directionin the plane with reference to the direction of material flow when thefilm is formed, for example.

<Thermal Properties, Mechanical Properties, Physical Properties andChemical Properties Of Polyimide Film>

The polyimide film as a raw material for the graphite used in thepresent invention has an average coefficient of linear expansion of lessthan 2.5×10⁻⁵/° C. at 100 to 200° C. When the coefficient of linearexpansion is less than 2.5×10⁻⁵/° C., the polyimide film is stretchedonly to a small extent and smoothly graphitized during thermaltreatment, and a graphite not fragile with various excellent propertiescan be obtained. Conversion of such a polyimide film used as a rawmaterial into the graphite starts at 2,400° C., and the polyimide filmcan be converted into a graphite having sufficient high crystallinity at2,700° C. The coefficient of linear expansion is more preferably2.0×10⁻⁵/° C. or less.

The coefficient of linear expansion of the raw material film isdetermined using a TMA (thermomechanical analyzer) by first heating asample to 350° C. at a heating rate of 10° C./min, then once cooling thesample with air to room temperature, again heating the sample to 350° C.at a heating rate of 10° C./min, and measuring the average coefficientof linear expansion at 100 to 200° C. at the second heating.Specifically, the coefficient of linear expansion is measured using athermomechanical analyzer (TMA: SSC/5200H; TMA120C, manufactured bySeiko Instruments Inc.) in a nitrogen atmosphere by placing a filmsample having a width of 3 mm and a length of 20 mm in a predeterminedjig and applying a load of 3 g to the sample in a tensile mode.

The polyimide film used in the present invention preferably has amodulus of elasticity of 2.5 GPa or more, and more preferably 3.4 GPa ormore, because such a film is more easily graphitized. Specifically, whenthe modulus of elasticity is 2.5 GPa or more, and more preferably 3.4GPa or more, the film can be prevented from being broken by shrinkage ofthe film during thermal treatment, and a graphite having variousexcellent properties can be obtained.

The modulus of elasticity of the film can be measured in accordance withASTM-D-882. The polyimide film has a modulus of elasticity of morepreferably 3.0 GPa or more, still more preferably 4.0 GPa or more, andyet more preferably 5.0 GPa or more. When the film has a modulus ofelasticity smaller than 2.5 GPa, the film is easily broken and deformedby shrinkage of the film during thermal treatment, and the resultinggraphite tends to be inferior in crystallinity, density and thermalconductivity.

The water absorption of the film is measured as follows. The film isabsolutely dried at 100° C. for 30 minutes to prepare a 25 μm-thick and10 cm-square sample. The weight of the sample is measured as A1. The 25μm-thick and 10 cm-square sample is dipped in distilled water at 23° C.for 24 hours, moisture on the surface is wiped and removed, andimmediately the weight of the sample is measured. The weight of thesample is A2. The water absorption is determined by the followingformula 3.

[Formula 3]

Water absorption (%)=(A2−A1)/A1×100  (3)

<Method for Preparing Polyimide Film>

The polyimide film used in the present invention can be produced bymixing an organic solution of polyamide acid as a polyimide precursorwith an imidization promoter, then casting the mixture on a support suchas an endless belt or stainless drum, and drying and firing the mixtureinto an imide.

The polyamide acid used in the present invention can be produced by aknown method. Typically, substantially equimolar amounts of at least onearomatic acid dianhydride and at least one diamine are dissolved in anorganic solvent. The resulting organic solution is stirred undercontrolled temperature conditions until polymerization of the aciddianhydride and the diamine is completed, so that the polyamide acid canbe produced. Such a polyamide acid solution is obtained typically at aconcentration of 5 to 35 wt %, and preferably at a concentration of 10to 30 wt %. An appropriate molecular weight and an appropriate solutionviscosity can be achieved when the solution concentration is within thisrange.

Any known method can be used as a polymerization method. For example,the following polymerization methods (1) to (5) are preferable.

(1) A method of dissolving an aromatic diamine in an organic polarsolvent and reacting the diamine with an aromatic tetracarboxylic aciddianhydride in a molar amount substantially equal to that of the diamineto polymerize these components.

(2) A method of reacting an aromatic tetracarboxylic acid dianhydridewith an aromatic diamine compound in a molar amount smaller than that ofthe dianhydride to obtain a prepolymer having an acid anhydride group ateach terminal; and subsequently polymerizing the prepolymer using anaromatic diamine compound in a molar amount substantially equal to thatof the aromatic tetracarboxylic acid dianhydride.

This method is the same as the method of synthesizing a prepolymerhaving an acid dianhydride at each terminal from a diamine and the aciddianhydride and synthesizing a polyamide acid by reaction of theprepolymer with a diamine differing from the diamine.

(3) A method of reacting an aromatic tetracarboxylic acid dianhydridewith an aromatic diamine compound in a molar amount larger than that ofthe dianhydride to obtain a prepolymer having an amino group at eachterminal; subsequently further adding an aromatic diamine compound tothe prepolymer; and then polymerizing the components using an aromatictetracarboxylic acid dianhydride in a molar amount substantially equalto the aromatic diamine compound.

(4) A method of dissolving and/or dispersing an aromatic tetracarboxylicacid dianhydride in an organic polar solvent; and then polymerizing thesolution and/or dispersion using an aromatic diamine compound in a molaramount substantially equal to that of the acid dianhydride.

(5) A method of reacting a mixture of substantially equimolar amounts ofan aromatic tetracarboxylic acid dianhydride and an aromatic diamine inan organic polar solvent to polymerize the mixture.

Among these, a method shown in (2) or (3) is preferable, in whichpolymerization is carried out by sequential control (sequence control)via a prepolymer (control of a combination of block polymers and aconnection of block polymer molecules). This is because a polyimide filmhaving a large birefringence and a small coefficient of linear expansionis easily obtained by using this method, and a graphite having highcrystallinity and excellent density and thermal conductivity is easilyobtained by thermally treating the polyimide film. It is assumed thatthe polyimide film is regularly controlled to have many overlappingaromatic rings and is easily graphitized even by thermal treatment at alow temperature. When the imide group content is made higher to increasethe birefringence, the carbon ratio in the resin is reduced and thecarbonization yield after graphite treatment is decreased. The polyimidefilm synthesized by sequential control is preferable, because thebirefringence can be increased without reducing the carbon ratio in theresin.

<Acid Dianhydrides>

Acid dianhydrides that can be used for synthesis of polyimide in thepresent invention include pyromellitic acid dianhydride,2,3,6,7-naphthalenetetracarboxylic acid dianhydride,3,3′,4,4′-biphenyltetracarboxylic acid dianhydride,1,2,5,6-naphthalenetetracarboxylic acid dianhydride,2,2′,3,3′-biphenyltetracarboxylic acid dianhydride,3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride,2,2-bis(3,4-dicarboxyphenyl)propane dianhydride,3,4,9,10-perylenetetracarboxylic acid dianhydride,bis(3,4-dicarboxyphenyl)propane dianhydride,1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride,1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride,bis(2,3-dicarboxyphenyl)methane dianhydride,bis(3,4-dicarboxyphenyl)ethane dianhydride, oxydiphthalic aciddianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride,p-phenylenebis(trimellitic acid monoester acid anhydride),ethylenebis(trimellitic acid monoester acid anhydride), (bisphenolA)bis(trimellitic acid monoester acid anhydride) and their analogs.These may be used singly or in a mixture of two or more at any ratio.

<Diamines>

Diamines that can be used for synthesis of polyimide in the presentinvention include 4,4′-oxydianiline, p-phenylenediamine,4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylmethane, benzidine,3,3′-dichlorobenzidine, 4,4′-diaminodiphenyl sulfide,3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfone,4,4′-diaminodiphenyl ether (4,4′-oxydianiline), 3,3′-diaminodiphenylether (3,3′-oxydianiline), 3,4′-diaminodiphenyl ether(3,4′-oxydianiline), 1,5-diaminonaphthalene,4,4′-diaminodiphenyldiethylsilane, 4,4′-diaminodiphenylsilane,4,4′-diaminodiphenylethylphosphine oxide, 4,4′-diaminodiphenylN-methylamine, 4,4′-diaminodiphenyl N-phenylamine, 1,4-diaminobenzene(p-phenylenediamine), 1,3-diaminobenzene, 1,2-diaminobenzene and theiranalogs. These may be used singly or in a mixture of two or more at anyratio.

In order to reduce the coefficient of linear expansion, increase themodulus of elasticity and increase the birefringence, it is preferableto use, as a raw material in particular, in production of a polyimidefilm in the present invention, an acid dianhydride represented by thefollowing formula (1):

wherein R₁ is any selected from divalent organic groups included in thefollowing formulas (2) to (14):

wherein each of R₂, R₃, R₄, and R₅ may be any selected from the group of—CH₃, —Cl, —Br, —F or —OCH₃.

A polyimide film having a relatively low water absorption is obtained byusing the above-described acid dianhydride. This is preferable becausefoaming by moisture can be prevented in the graphitization process.

In particular, an organic group including a benzene nucleus representedby the formulas (2) to (14) is preferably used as R₁ in the aciddianhydride, because the resulting polyimide film has high molecularorientation, a small coefficient of linear expansion, a high modulus ofelasticity, a high birefringence and a low water absorption.

In order to further reduce the coefficient of linear expansion, furtherincrease the modulus of elasticity, further increase the birefringenceand further reduce the water absorption, an acid dianhydride representedby the following formula (15) may be used as a raw material in synthesisof polyimide in the present invention.

In particular, a polyimide film obtained using, as a raw material, anacid dianhydride having a structure in which benzene rings are linearlybonded through two or more ester bonds contains a flexing chain buttends to have an extremely linear conformation in its entirety and isrelatively rigid. As a result, the coefficient of linear expansion ofthe polyimide film can be reduced to, for example, 1.5×10⁻⁵/° C. or lessby using this raw material. Further, the modulus of elasticity can beincreased to 5.0 GPa or more and the water absorption can be reduced to1.5% or less.

In order to further reduce the coefficient of linear expansion, furtherincrease the modulus of elasticity and further increase thebirefringence, polyimide in the present invention is preferablysynthesized from p-phenylenediamine as a raw material.

The most appropriate diamines used for synthesis of polyimide in thepresent invention are 4,4′-oxydianiline and p-phenylenediamine. One ortwo of these diamines is preferably 40 mol % or more, more preferably 50mol % or more, still more preferably 70 mol % or more, and yet morepreferably 80 mol % or more in total based on the total diamines.Further, p-phenylenediamine is contained preferably at 10 mol % or more,more preferably 20 mol % or more, still more preferably 30 mol % ormore, and yet more preferably 40 mol % or more. When the content ofthese diamines is less than the lower limit of the mol % ranges, theresulting polyimide film tends to have a high coefficient of linearexpansion, a small modulus of elasticity and a small birefringence.However, when the total diamine content is the content ofp-phenylenediamine, it is difficult to obtain a thick polyimide film inwhich only a small amount of foam is generated. Thus, it is preferableto use 4,4′-oxydianiline.

The most appropriate acid dianhydrides used for synthesis of a polyimidefilm in the present invention are pyromellitic acid dianhydride and/orp-phenylenebis(trimellitic acid monoester acid dianhydride) representedby the formula (15). One or two of these acid dianhydrides is preferably40 mol % or more, more preferably 50 mol % or more, still morepreferably 70 mol % or more, and yet more preferably 80 mol % or more intotal based on the total acid dianhydrides. When the amount of theseacid dianhydrides used is less than 40 mol %, the resulting polyimidefilm tends to have a high coefficient of linear expansion, a smallmodulus of elasticity and a small birefringence.

Additives such as carbon black and graphite may be added to a polyimidefilm, polyamide acid or polyimide resin.

Preferable solvents for synthesizing a polyamide acid include amidesolvents such as N,N-dimethylformamide, N,N-dimethylacetamide andN-methyl-2-pyrrolidone. N,N-dimethylformamide and N,N-dimethylacetamidemay be particularly preferably used.

Polyimide may be produced by a thermal cure method in which a polyamideacid as a precursor is converted into an imide by heating, or a chemicalcure method in which a polyamide acid as a precursor is converted intoan imide using a dehydrating agent represented by an acid anhydride suchas acetic acid anhydride and an imidization promoter that is a tertiaryamine such as picoline, quinoline, isoquinoline or pyridine. Inparticular, a high boiling imidization promoter such as isoquinoline ispreferable. This is because the boiling imidization promoter is notevaporated at the initial stage of preparation of the film and easilyexhibits the catalytic effect even in the last process of drying. Thechemical cure method is more preferable, particularly because theresulting film has a small coefficient of linear expansion, a highmodulus of elasticity and a high birefringence, can be rapidlygraphitized at a relatively low temperature, and can provide a graphitewith high quality. The dehydrating agent and the imidization promoterare particularly preferably used in combination, because the resultingfilm has a high coefficient of linear expansion, a high modulus ofelasticity and a high birefringence. The chemical cure method is anindustrially advantageous method with excellent productivity, in whichimidization reaction more rapidly proceeds and thus the imidizationreaction can be completed in a short time in heating treatment.

When the film is specifically produced using the chemical cure method, astoichiometric amount or more of a dehydrating agent and an imidizationpromoter made of a catalyst are first added to a polyamide acidsolution; the mixture is cast on or applied to a support such as asupport plate, an organic film of PET or the like, a drum or an endlessbelt to form a film; and the organic solvent is evaporated to obtain aself-supporting film. Then, the self-supporting film is further heatedto dry and imidize the film, thereby obtaining a polyimide film. Thetemperature in the heating is preferably 150° C. to 550° C. The heatingrate in heating is not specifically limited. It is preferable thatheating be gradually carried out continuously or stepwise so that thehighest temperature is within the predetermined temperature range. Theheating time varies according to the thickness of the film and thehighest temperature, and is generally preferably 10 seconds to 10minutes after reaching the highest temperature. Further, the step ofproducing a polyimide film preferably includes a step of fixing orstretching the film in order to prevent shrinkage, because the resultingfilm tends to have a small coefficient of linear expansion, a highmodulus of elasticity and a high birefringence.

<Graphitization of Raw Material Film Including Polyimide Film>

In graphitization treatment, the raw material film is converted to agraphite structure after carbonization by thermal treatment. In thiscase, a carbon-carbon double bond must be cleaved and recombined. Inorder to make graphitization occur as easily as possible, it isnecessary to make the cleavage and recombination occur at a minimumenergy. Molecular orientation of the starting raw material film (forexample, polymer films listed above, in particular, a polyimide film)affects arrangement of carbon atoms in the carbonized film, and themolecular orientation can reduce the energy for cleavage andrecombination of the carbon-carbon double bond in graphitization.Accordingly, graphitization at a relatively low temperature can becarried out by designing molecules so that a high degree of molecularorientation easily occurs. The effect of the molecular orientation ismore significant when the molecular orientation is a two-dimensionalmolecular orientation parallel to the film plane.

The second feature of graphitization reaction is that a thick rawmaterial film is difficult to be graphitized at low temperatures.Accordingly, when the thick raw material film is graphitized, a graphitestructure may not be formed in the inside of the film even if a graphitestructure is formed in the surface layer. Molecular orientation of theraw material film promotes graphitization in the film and, as a result,the raw material film can be converted into an excellent graphite at alower temperature.

The surface layer and the inside of the raw material film aregraphitized almost at the same time, so that a graphite structure formedin the surface layer can be prevented from being broken by gas generatedin the film and a thicker film can be graphitized. The raw material filmprepared in the present invention (for example, polymer films listedabove, in particular, a polyimide film) is assumed to have a molecularorientation most suitable for generating such an effect.

An aspect of the process for producing a graphite film according to thepresent invention is a process for producing a graphite film comprisingat least the carbonization step of carbonizing a polymer film to producea carbonized polymer film; and the graphitization step of graphitizingthe carbonized polymer film to produce a graphite film.

<Carbonization Step>

The carbonized polymer film used as an example of the raw material filmof the present invention is preferably obtained by preheating a polymerfilm as a starting material under reduced pressure or in an inert gas.The preheating is carried out typically at a temperature of about 1,000°C. For example, when the polymer film is heated at a rate of 10° C./min,the temperature of the film is preferably maintained in a temperaturerange of 1,000° C. for about 30 minutes. More specifically, thecarbonization temperature for the polymer film is suitably 600° C. andmore and less than 2,000° C.

Accordingly, the carbonized polymer film used as an example of the rawmaterial film of the present invention is preferably obtained bythermally treating a polymer film at a temperature of 600° C. to 1,800°C. The thermal treatment temperature is 1,000° C. or more, morepreferably 1,100° C. or more, still more preferably 1,200° C. or more,and particularly preferably 1,400° C. or more.

The carbonization temperature is preferably less than 2,000° C., becausegraphitization is carried out by electrical heating described later toobtain a graphite with excellent thermal conductivity, electricalconductivity and flatness. The carbonization temperature is preferably600° C. or more, because the stacked graphitized raw material films aredifficult to be adhered to each other during thermal treatment, and itis possible to prevent deviation of the position of the raw materialfilms due to decomposition gas or deformation of the raw material filmsin the graphitization step. Thus, wrinkles and cracks of the resultingfilms can be prevented. In sum, the film is shrunk in the thicknessdirection and the plane direction in the carbonization step, and thefilm is shrunk in the thickness direction and expanded in the planedirection in the graphitization step. Therefore, when the raw materialfilm is a polymer film, shrinkage of the film in the plane direction issuppressed by applying pressure in the thickness direction, and thus thefilm may have wrinkles or cracks. However, when the raw material film isa carbonized polymer film, expansion of the film in the plane directionis rather promoted by applying pressure in the thickness direction, andthus a graphite having excellent quality can be easily obtained. Whenthe raw material film is a carbonized polymer film, the film is lessdeformed than a polymer film. Therefore, deviation in position of thefilm by deformation can be prevented and this is extremely preferable.In electrical heating, the raw material film and/or the graphitecontainer are covered with carbon particles described later duringthermal treatment. When a carbonized polymer film is used as the rawmaterial film, the raw material film is dense and has high corrosionresistance, and thus the film is resistant to erosion and deteriorationby the carbon particles, the graphite container, impurities such asmetals intruding from the outside and gas from the outside duringthermal treatment. Therefore, a large number of graphite films can beprepared having more excellent thermal conductivity, electricalconductivity and flexibility and having a small difference in quality inthe plane (particularly between the film center and the film edges).

A carbonized polymer film is preferably used as the raw material film,because current flows both in the surface layer and in the inside of thefilm in the graphitization step by electrical heating, so that heat issimultaneously generated both in the surface layer and in the inside andthe film is uniformly graphitized.

The temperature as described in the present specification can bemeasured using a radiation thermometer or the like in part of the outerwall or inside of a directly electrifiable container, for example. Theterm “thermal treatment” used in the present specification includes notonly heating under reduced pressure and heating in a gas atmosphere inthe conventional art, but also electrical heating which is a feature ofthe present invention and transfer itself of heat generated byelectrification to the raw material film; that is, this term is used ina broad sense including multiple principles.

<Graphitization Step>

The graphitization step of the present invention may be carried out byonce removing the polymer film carbonized by the carbonization step froma furnace for the carbonization step and transferring the film to agraphitization furnace. Alternatively, the carbonization step and thegraphitization step may be continuously carried out in a single furnace.

<Graphitization Step Atmosphere>

The graphitization step is carried out under reduced pressure or in aninert gas. Argon or helium is appropriate for the inert gas.

<Graphitization Step Temperature>

In the process for producing a graphite film according to the presentinvention, the thermal treatment temperature must be at least 2,000° C.The final thermal treatment temperature is preferably 2,400° C. or more,more preferably 2,600° C. or more, and still more preferably 2,800° C.or more. Such a thermal treatment temperature can provide a graphitehaving excellent thermal conductivity. As the thermal treatmenttemperature is higher, the polymer film can be converted into a graphitewith higher quality. From the economic point of view, it is preferableto convert the polymer film into a graphite with high quality at atemperature as low as possible. In order to realize an ultrahightemperature of 2,500° C. or more, typically, current is directly causedto flow into a graphite heater and heating is carried out using Jouleheat of the heater. The graphite heater is consumed at 2,700° C. ormore. The consumption speed at 2,800° C. of the graphite heater is about10 times that at 2,700° C., and the consumption speed at 2,900° C. ofthe graphite heater is about 10 times that at 2,800° C. Accordingly, itis considerably economically advantageous if the polymer film as a rawmaterial is improved to reduce the temperature at which the polymer filmcan be converted into a graphite with high quality from 2,800° C. to2,700° C., for example. The highest temperature at which thermaltreatment can be carried out is 3,000° C. in an industrial furnacecommonly available now.

<Electrical Heating>

In the graphitization step of the present invention, a raw material filmmade of a polymer film and/or a carbonized polymer film is preferablygraphitized by an electrical heating method of retaining the film in andin contact with a container that can be directly electrified byapplication of voltage (direct electrification container) andelectrifying the container by application of AC voltage and/or DCvoltage. Since heat is generated by the container itself and thus theraw material film is electrically heated by application of voltage inthis method, heat generation by the raw material film itself contributesto graphitization. In sum, when the graphitization step is carried outby the electrification method, the film is heated by two means: directheat conduction from the heated container and self-heat generation ofthe film, so that the inside and the surface of the film are uniformlyheated, and the film is also sufficiently uniformly heated from theperiphery of the film, so that the surface and the inside of the filmare uniformly graphitized. Therefore, a graphite film having excellentcrystallinity and high quality can be obtained. Since the graphite layeris uniformly grown in the plane in the graphite film obtained throughthe graphitization step by the electrical heating method, the graphitefilm tends to be excellent in density and thermal diffusivity; is flatwithout flaws, wrinkles and recesses on the surface even afterperforming rolling treatment or pressurizing treatment; and haselectrical conductivity and thermal conductivity more excellent than ina conventional graphite film. Such a method of retaining a raw materialfilm in and in contact with a container that can be directly electrifiedby application of voltage may be, but is not necessarily limited to, amethod of holding a raw material film with a metal plate or graphiteplate and retaining the film in contact with the container wall orcontainer bottom with no pressure particularly applied other than theself-weight of the metal plate or graphite plate, for example. A currentof 10 mA or more flows in the raw material film, for example, as aresult of electrification, depending on the size of the sample, based onelectrical conductivity of the directly electrifiable container and thegraphite film produced. In particular, even when the initial rawmaterial film is transformed from an insulator to a conductor during thecurrent flows, a graphite film with high quality can be produced in astable manner by controlling the input electric power to prevent adrastic increase in temperature.

On the other hand, in conventional thermal treatment in a normalatmosphere and under reduced pressure, heating is carried out by heatconduction from atmospheric gas and/or radiation heat from a heater, orby heat conduction from a part in contact with a heater. Therefore, thefilm is non-uniformly heated by thermal conduction from the surface tothe inside, basically. Thus, growth of the graphite layer tends topartially vary, and the film tends to be adversely affected bydecomposition gas generated and partial defects tend to occur in crystalrearrangement during graphitization. In particular, when the rawmaterial film is thick, the film is graphitized from the surface, makingit difficult to release decomposition gas from the inside, and the filmis broken by forced release of decomposition gas. Even if the film isnot broken, the film is not sufficiently internally graphitized unlikethe case where the film is thin, and only a graphite film having thermalconductivity extremely inferior can be obtained.

Further, in the process of the present invention, one surface and theother surface of a carbonized polymer film are brought into contact witha conductor (a container (which may be a graphite container) and/orcarbon powder). Therefore, Joule heat generated by application ofvoltage is immediately transferred from both the one surface and theother surface of the film. Accordingly, even when a relatively thick rawmaterial film having a thickness of about 125 μm or 225 μm, for example,is used, the inside, the surface and the periphery of the film areuniformly heated. Therefore, the surface and the inside aresimultaneously graphitized, a graphite layer to prevent generation ofdecomposition gas is not formed in the surface layer, decomposition gasin the inside is easily released, and the film is not broken bydecomposition gas. Thus, a thick graphite film having excellentelectrical conductivity and thermal conductivity can be obtained.

Further, the raw material film is also preferably an insulator polymerfilm, because one surface and the other surface of the raw material filmare brought into contact with a directly electrifiable container in theproduction process of the present invention, so that Joule heatgenerated by application of voltage is immediately transferred from bothcontacting parts and the film is carbonized.

Moreover, when the graphite film prepared by electrical heating isrolled or pressurized, a flat graphite film without flaws, wrinkles andrecesses on the surface is easily obtained; however, when a conventionalgraphite film obtained by atmospheric heating or heating under reducedpressure is rolled or pressurized, the resulting graphite film isgenerally flat as a whole, but may have recesses with a depth of 1 mm orless visually observed and have flaws and wrinkles on the surface.

<Electrifiable Containers A and B>

Examples of the graphitization step by electrical heating of the presentinvention include a method of retaining a raw material film in agraphite container and electrifying the graphite container itself byapplication of voltage; a method of retaining a raw material film in agraphite container, covering the outer periphery of the graphitecontainer with carbon powder (packing carbon powder in the outerperiphery), and electrifying the graphite container itself byapplication of voltage through the carbon powder; a method of retaininga raw material film covered with carbon powder in a graphite container(retaining the raw material film with the carbon powder packed betweenthe graphite container and the raw material film) and electrifying thegraphite container itself by application of voltage; and a method ofretaining a raw material film covered with carbon powder in a graphitecontainer (retaining the raw material film with the carbon powder packedbetween the graphite container and the raw material film), covering thegraphite container with carbon powder (with the carbon powder packed inthe outer periphery of the graphite container), and electrifying thegraphite container itself by application of voltage through the carbonpowder. One aspect of the graphitization step preferably includesretaining one or more stacked raw material films in and in contact witha container A described later that can be directly electrified byapplication of voltage, retaining the container A in a similarlyelectrifiable container B, and graphitizing the films by electrifyingthe whole. Examples of the retention method used in this step include aretention method shown in any of FIGS. 1 to 3.

On the other hand, when the container A is not retained in the containerB, specifically, when not two containers but one container is used tocarry out the step of graphitizing a raw material film by directelectrification, it is preferable to retain the raw material film in andin contact with one directly electrifiable container, cover the outerperiphery of each of such containers with carbon powder in contact withthe outer periphery, and electrifying the whole to prepare a graphitefilm. In this case of electrifying many containers each covered withcarbon powder to produce graphite films, quality of the producedgraphite films may vary according to the packing density of the carbonpowder or the difference in electric resistance between the containersthemselves.

<Container Material>

Examples of the material for such containers A and B include tungsten,molybdenum and graphite. In an application in which electrical heatingto a temperature range of 2,500° C. is carried out as in the presentinvention, graphite is particularly preferable taking easiness inhandling, industrial availability and the like into consideration.Graphite herein includes, in a broad sense, a material containinggraphite as a main component insofar as the material can be heated tothe above temperature range. Graphite may be isotropic graphite orextruded graphite, for example. When allowing current to flow in orrepeatedly using graphite, isotropic graphite having excellentelectrical conductivity, thermal conductivity and uniformity ispreferable.

In the process for producing a graphite film according to the presentinvention, a simple flat container or cylindrical container can be used.When a cylindrical container is used, the raw material film can be woundaround and stored in the container. In the process for producing agraphite film according to the present invention, a rectangularparallelepiped container, a cubic container, a block-shaped container, alunch box-shaped container with a lid, or the like is preferable,particularly because such a container can be easily prepared and ishighly industrially available and the raw material film is preferablyretained in contact with the container.

<Container Shape>

The container B preferably has a cylindrical shape. This is becausevoltage is biased during electrification more difficulty in a cylinderthan in a rectangular tube, making it easy to electrically heat thewhole container A uniformly.

The container A preferably has an angular shape such as a cubic orrectangular parallelepiped shape or a cylindrical shape takingindustrial availability into consideration and preferably has acylindrical shape with a lid taking operational convenience intoconsideration.

The containers A and B independently may or may not be used in a closedstate. Each of the containers may be in a closed state with a cover. Theinside of the container in a closed state may be pressurized to abovenormal pressure or depressurized to below normal pressure in accordancewith the presence of gas expanded or shrunk as a result of heating orcooling. Each of the containers may not be in a closed state by allowinggas expanded or shrunk as a result of heating or cooling to enter orexit from the container through a space between the container and acover (such as a lid), for example.

FIG. 1 shows a state where the outer periphery of the directlyelectrifiable container A is covered with carbon powder (carbon powderis present on the outer periphery of the container A) and the containerA is retained not in contact with the container B.

In FIG. 2, the container A is retained in and in contact with thedirectly electrifiable container B in the above-described state (wherecarbon powder is present on the outer periphery of the container A).

In FIG. 3, the directly electrifiable container A is retained in and incontact with the directly electrifiable container B. In FIG. 3, carbonpowder is not used for retaining the container A in the container B. Thecarbon powder in this case is used for bringing the container B intoelectrical contact with the container A.

As described above, in the present invention, the graphitization step iscarried out by retaining the container A in the container B, with one ormore stacked raw material films retained in and in contact with thecontainer A, so that voltage and heat can be uniformly applied to thecontainer A. Therefore, there is no difference in quality of graphitesprepared between the containers A. Further, since the density of thecarbon powder on the outer periphery of the container A (packing densitywhen packed) can be easily uniform, even if many containers A areretained in the container B, there is no difference in quality ofgraphites prepared between the containers A. That is, the graphitecontainer and/or the raw material film can be uniformly electrified andheated by covering the container retaining the raw material film withcarbon powder.

When the container A is retained in the container B and electrified byapplication of voltage, it is preferable not to bring the container Ainto contact with the container B. This is because, when the container Ain contact with the container B is electrified by application ofvoltage, the container A is electrified only from the part of thecontainer A in contact with the container B, and thus the container A isnot uniformly electrically heated and the raw material may beinsufficiently uniformly graphitized. Further, when the container A isretained in and in contact with the container B, with the outerperiphery of the container A covered with carbon powder, the container Ais electrified both through the part in contact with the container B andthrough the carbon powder covering the outer periphery of the containerA. However, since electric resistance differs between the container Band the carbon powder, the container A is electrified primarily throughthe container B or the carbon powder having lower electric resistance,and thus the container A may be electrically heated insufficientlyuniformly.

On the other hand, when the container A is retained in and not incontact with the container B, with the outer periphery of the containerA covered with carbon powder (with the carbon powder present (preferablypacked) on the outer periphery of the container A), the whole containerA is uniformly electrified by application of voltage through the carbonpowder present (preferably packed) on the outer periphery of thecontainer A. Therefore, the container A can be uniformly electricallyheated without partial voltage bias, and an excellent graphite filmwithout variation in quality can be produced.

Due to the above-described reasons, the method shown in FIG. 1 is mostpreferable, the method shown in FIG. 2 is second most preferable, andthe method shown in FIG. 3 is third most preferable for retaining thecontainer A in the container B.

In addition to the retention state in any of FIGS. 1 to 3, a retentionstate is also preferable where the periphery of the raw material film iscovered with carbon powder (the carbon powder is present (preferablypacked) between the container A and the raw material film).

A retention state is also preferable where the outer periphery of thecontainer B is covered with carbon powder (the carbon powder is present(preferably packed) on the outer periphery of the container B).Specifically, voltage is applied to carbon powder present on the outerperiphery of the container B, with the outer periphery of the containerB covered with the carbon powder (with the carbon powder present(preferably packed) on the outer periphery of the container B) as shownin FIG. 5, so that the container A and/or the raw material film areelectrified through the carbon powder, the container B and the carbonpowder between the container A and the container B.

On the other hand, voltage may be directly applied to the container B asshown in FIG. 4; however, the retention method shown in FIG. 5 issuperior to this method in order to obtain an excellent graphite filmhaving high thermal conductivity and no variation in properties. This isbecause the container B and/or the raw material film can be uniformlyelectrified and heated by covering the container with carbon powder.

As described above, the graphitization step by electrical heating ispreferably carried out with the periphery of the raw material filmcovered with carbon powder, because the raw material film is uniformlyelectrified and heated.

<Carbon Powder>

The carbon powder used in the present invention is carbon powder heatedto a temperature range of 2,500° C. (by electrification) as in thepresent invention. Examples of the carbon powder include carbonparticles and graphite particles. That is, the carbon powder is hereinused in a broad sense without specific limitations insofar as it refersto powder containing carbon as a main component. For example, the carbonpowder may be prepared by thermally treating a substance, powder orfiber containing an organic substance as a main component and thencrushing the product into powder or granulating the product. The thermaltreatment temperature is 200° C. or more, more preferably 500° C. ormore, and still more preferably 1,000° C. or more or 1,500° C. or more.It is also possible to use a substance containing carbon as a maincomponent such as natural and/or artificial pitch, coke or carbon black.The carbon powder may be graphite particles. The graphite particlesherein include, in a broad sense, a material containing graphite as amain component insofar as the material can be heated to the abovetemperature range. Examples of the graphite particles include crushedgraphite cloth, crushed isotropic graphite, crushed extruded graphite,and carbon black. The powder shape, the particle size, the particle sizedistribution, and the like of the carbon powder are not specificallylimited.

<Angle Formed by Electrification Direction and Normal Line of RawMaterial Film>

In such electrification of the present invention, the angle formed bythe electrification direction and the normal line of the raw materialfilm surface is suitably more than 0° and less than 180°, preferably 60°and more and 120° or less, still more preferably 75° and more and 105°or less, and most preferably 90°. When the formed angle is 90°, theelectrification direction is in the in-plane direction of the rawmaterial film to make the raw material film uniformly electrified, andthe electrification distance is long to promote heating of the rawmaterial film itself. Therefore, a graphite film having excellentquality is easily obtained. On the other hand, when the angle formed bythe electrification direction and the normal line of the raw materialfilm surface is approximately 0°, that is, the electrification directionis the thickness direction of the raw material film, electrification maybe prevented by resistance of the raw material film itself.

<Planar Pressurization>

In the graphitization step of the present invention, the raw materialfilm is preferably graphitized with pressure applied to the raw materialfilm planarly. Since carbon rearrangement is easily directed in theplane direction of the film in the graphitization process, a graphitefilm having high crystallinity can be obtained. Accordingly, a graphitefilm excellent in flatness and thermal diffusivity can be obtained.

Such a “planar pressurization” state can be realized by the self-weightof the stacked films; the self-weight of a jig used for holding the rawmaterial film; the pressure received by the raw material film from a lidof a directly electrifiable container; the expansion of a directlyelectrifiable container around the raw material film by heating; and thepressure received by the raw material film by the expansion of a jigused for holding the film, for example.

On the other hand, when excessive pressure is applied to the rawmaterial film in the graphitization step, free extension and shrinkageof the film itself are prevented, and free growth of graphitecrystallites is prevented and rather the crystallites are broken, sothat a graphite film having high quality may not be obtained. Therefore,the pressure is preferably reduced in part of the graphitization step inthe “planar pressurization” state. For example, when two or more rawmaterial films are stacked, cushioning properties are increased due tocontact of the films with each other. Accordingly, even when excessivepressure is applied, breakage and partial adhesion of the films can beprevented to a certain extent. Furthermore, the pressure can be morestrongly changed.

The initial pressure is preferably 0.0001 kg/cm² or more and less than 4kg/cm². An initial pressure of 0.0001 kg/cm² or more promotes expansionof the film in the plane direction in graphitization during thermaltreatment and can provide a graphite film with excellent thermalconductivity and flatness. An initial pressure of less than 4 kg/cm² canprevent the raw material film from being pressure bonded during thermaltreatment and can provide a graphite film having excellent thermalconductivity and flatness without wrinkles and cracks.

In order to obtain an excellent graphite film, pressure is preferablyplanarly applied to the raw material film until thermal treatment forgraphitization is completed. However, when excessive pressure isplanarly applied to the raw material film, the graphite film is brokenduring thermal treatment. Therefore, in order to obtain a graphite filmhaving excellent flatness without breakage, it is preferable thatpressure planarly applied to the raw material film be reduced in part ofthe graphitization step and the pressure be applied until thermaltreatment is completed.

The pressure can be reduced in part of the graphitization step bydevising a container in contact with the raw material film and retainingthe film. Here, a lunch box-shaped container with a lid will bedescribed as a specific example of such a container; however, such acontainer is not limited to this example insofar as a container havingthe same effect in principle is used.

When the stacked raw material films are retained in contact with a lunchbox-shaped container with a lid, the thickness of the raw material filmsis reduced as graphitization proceeds. On the other hand, the height ofthe lunch box-shaped container with a lid is not changed except for thedeformed part due to thermal expansion. Therefore, the pressure betweenthe container lid and the stacked films is reduced, pressure bonding ofthe raw material films can be prevented during thermal treatment, andgraphite films having excellent thermal conductivity and flatnesswithout wrinkles and cracks can be obtained.

<Stacking>

In the graphitization step of the present invention, the number of theraw material films treated at the same time may be one or may be two ormore, and preferably 10 or more. The multiple raw material films areparticularly preferably graphitized as stacked. Such a stacked state maybe a state where the raw material films are simply stacked. There are nospecific limitations to the stacking direction of the films (thestacking direction may be a direction in which the carbonized rawmaterial films are stacked with every film deviated at 90°, for example)and the stacking method. The stacked raw material films do not have tohave an equal area. The number of the stacked films is preferably 10 ormore, more preferably 30 or more, and still more preferably 100 or more.

<Carbon Material>

The graphitization step of the present invention is preferably carriedout in the stacked state with a carbon material having a height smallerthan the height of the stacked raw material films present around the rawmaterial films. This makes it possible to suppress application ofexcessive pressure to the raw material films planarly, where thepressure is reduced as the thickness of the raw material films isreduced due to graphitization of the raw material films in this step.Specifically, it is possible to apply planar pressure to the rawmaterial films only corresponding to the height of the carbon materialby a graphite jig used for holding the raw material films. Thus,adhesion of the films to each other can be prevented.

Such a carbon material is set to have a height H in the range of 0.2 to0.9, more preferably in the range of 0.3 to 0.8, and still morepreferably 0.4 to 0.7, which is calculated by the formula 4 as a ratioof a height of the carbon material to a stacking height of the rawmaterial films. The height of the carbon material set in this manner issimilar to the stacking height of the raw material films aftergraphitization, making it possible to suppress application of excessivepressure to the raw material films and maintain pressure to be appliedto the raw material films until thermal treatment in the graphitizationstep is completed. This is because, when the raw material film used is apolymer film, the thickness of the resulting graphite film is often 40%to 60% of the thickness of the original polymer film, and when the rawmaterial film used is a carbonized polymer film, the thickness of theresulting graphite film is often 50% to 70% of the thickness of theoriginal carbonized polymer film. Such a carbon material may be amaterial described in the aforementioned section <Carbon powder>, andthe shape of the carbon material is not particularly limited insofar asthe material is present around the stacked raw material films.

[Formula 4]

H=(Height of carbon material (mm)/(Stacking height of raw material films(mm))  (4)

<Electrification×Stacking>

In the graphitization method using electrical heating as describedlater, when multiple raw material films are used rather than a singleraw material film, the resulting graphite films have more excellentthermal conductivity. This is presumably because the graphite filmobtained by electrical heating has extremely high thermal conductivityand electrical conductivity, so that when stacked raw material films areretained in contact with an electrifiable container and graphitized byelectrical heating, the percentage of the raw material films occupied inthe container is increased as compared with the case where a single rawmaterial film is used; the raw material films are more electrified thanthe container; and films having excellent thermal conductivity tend tobe obtained. When the graphite films obtained by electrically heatingmultiple stacked raw material films rather than a single raw materialfilm are rolled and compressed, extremely flexible graphite films can beobtained. This is primarily because graphite layers are developed in theplane direction, presumably. In electrical heating, the raw materialfilm and/or the graphite container are covered with carbon particlesdescribed later during thermal treatment. When the stacked raw materialfilms are thermally treated, the films are resistant to erosion anddeterioration by the carbon particles, the graphite container,impurities such as metals intruding from the outside and gas from theoutside during thermal treatment. Therefore, a large number of graphitefilms can be prepared having more excellent thermal conductivity,electrical conductivity and flexibility and having a small difference inquality in the plane (particularly between the film center and the filmedges).

<Pressurization×Stacking>

In the graphitization with pressurization as described later, whenmultiple raw material films are used rather than a single raw materialfilm, the resulting graphite films have more excellent thermalconductivity without breakage and wrinkles. This is presumably becausethe graphite film obtained by thermal treatment of a polymer film hasextremely high thermal conductivity and electrical conductivity, so thatwhen stacked and pressurized raw material films are graphitized, thepercentage of the raw material films occupied in the container isincreased as compared with the case where a single raw material film isused; the raw material films are more electrified than the container;and films having excellent thermal conductivity tend to be obtained.When the raw material film is brought into contact with, retained in andfixed to the graphite container, the film is thermally treated with thefilm held by a graphite plate from up and down. When a single rawmaterial film is used, the film is brought into contact with thegraphite plate. However, when multiple raw material films are used, theraw material films each thinner than the graphite plate are brought intocontact with each other and have followability to the raw material filmshigher than to the graphite plate, so that graphite films having a smallnumber of wrinkles and cracks are easily obtained.

<Electrification×Pressurization>

When graphitization is carried out using electrical heating andpressurization in combination, a graphite film having excellent flatnesswithout wrinkles and cracks can be obtained even by thermally treating asingle film held by a plate having inferior followability such as agraphite plate. Even when the stacked raw material films are treated,mutual adhesion of the raw material films can be prevented unlike a casewhere the films are only pressurized, and graphite films havingexcellent thermal conductivity can be obtained. This is presumablybecause graphitization is further promoted using electrical heating andpressurization in combination.

<Carbonization×Stacking×Electrification>

When voltage is applied to a container with one or more carbonizedpolymer films stacked, current flows in the films according to thechange in electric resistance corresponding to the progression ofcarbonization, because the films are already carbonized. Further, asgraphitization proceeds, resistance is lower and thus an increasedamount of current flows in the films. Accordingly, heat is generated inthe whole stacked films themselves. In particular, since current flowsin both the surface layer and the inside of each of the stacked films,heat generation simultaneously proceeds in both the surface layer andthe inside. As a result, the films are uniformly graphitized.

Further, current flows according to the change in electric resistancecorresponding to the progression of carbonization. As graphitizationproceeds, resistance is lower and the amount of current flowing in thefilms is increased. Thus, the amount of heat generation in the films isincreased and the films are easily graphitized. In particular, even ifthe amount of heat generation is partially increased, thermalconductivity is increased as the films themselves generate heat and aregraphitized. Therefore, heat is transferred to the whole stacked filmsand each of the stacked films is uniformly heated.

A carbonized polymer film before graphitized tends to have thermalconductivity inferior to that of a graphite. Therefore, since thermalconduction is only one heating means in conventional atmospheric thermaltreatment or thermal treatment under reduced pressure, it is difficultfor heat to be sufficiently transferred to the inside of the stackedfilms; the graphitization state tends to differ between the surfacelayer and the inside; and only the upper and lower films among thestacked films tend to be graphitized and an insufficiently graphitizedpart tends to remain in the middle films among the stacked films. As aresult, when the multiple stacked films are thermally treated at hightemperatures in the conventional method, the insufficiently graphitizedpart in the films is expanded and burst and the films are completelybroken.

On the other hand, in the process of the present invention, thecontainer itself that can be directly electrified by application ofvoltage is heated by application of voltage, and at the same timecurrent flows in the carbonized part of the carbonized polymer filmaccording to the change of electric resistance corresponding toprogression of carbonization or graphitization, and the film itselfgenerates heat. Accordingly, heat can be sufficiently supplied to thefilm by two means: direct heat transfer from a heated container andself-heat generation of the film, so that heat can be sufficientlysupplied even to the middle films among the stacked films; and not onlyare the upper and lower films among the stacked films graphitized butall the stacked films are simultaneously graphitized.

Moreover, since electrical conductivity is uniformly increased in theplane of each of the stacked films, partial electric field concentrationdoes not occur in the film and local heat generation does not occur. Asa result, the surface and the inside of the film are uniformlygraphitized. Further, since the graphite after thermal treatment hasextremely excellent crystallinity and excellent thermal resistance, thegraphite is not broken even if locally heated by concentration of theelectric field, and thus has high quality.

As described above, in the present invention, a conductor is evenbrought into contact with the surface of each end film of one or morestacked carbonized polymer films. Accordingly, when the films areelectrically heated by application of voltage, carbonization firstproceeds from both surfaces of the films; current subsequently flows inthe inside of the films according to the change in electric resistancecorresponding to progression of carbonization in the inside of thefilms; the amount of current flowing in the films is increased ascarbonization proceeds; and finally the stacked films are uniformlyheated. For this reason, the films are easily uniformly graphitized.Moreover, since electrical conductivity is uniformly increased in theplane of each of the stacked films, partial electric field concentrationdoes not occur in the film and local heat generation does not occur. Asa result, the surface and the inside of the film are uniformlygraphitized. Further, since the graphite after thermal treatment hasextremely excellent crystallinity and excellent thermal resistance, thegraphite is not broken even if locally heated by concentration of theelectric field, and thus has high quality.

<Post-Planar Pressurization Step>

The process for producing a graphite film according to the presentinvention preferably comprises the “post-planar pressurization step” offurther planarly pressurizing a raw material film graphitized throughthe graphitization step, that is, a graphite film. A graphite film canbe obtained having a high diffusivity, a high density, and excellentflatness without flaws, recesses and wrinkles on the surface. Such a“post-planar pressurization step” may be carried out at roomtemperature.

In such a “post-planar pressurization step”, the graphite film ispreferably planarly pressurized together with a film-like medium otherthan the graphite film.

It is preferable to planarly pressurize the multiple graphite filmsplaced as stacked. Since the graphite films themselves function ascushioning materials, graphite films can be obtained with excellentflatness without flaws on the surface.

Such “post-planar pressurization” can be carried out by single-platepress, vacuum press or the like. Vacuum press is particularlypreferable, because uniform planar pressurization is performed, andvacuuming is performed to make it possible to compress the air layercontained in the graphite film.

More specifically, the post-planar pressurization may be carried out bya method of pressurizing the graphite film using a planarlypressurizable apparatus such as a pressing machine, a hot pressingmachine or a single-plate pressing machine; or a method of holding thegraphite film with a plastic plate, a ceramic plate or a metal plate andbolting the film, for example. When such a method is used, pressure canbe uniformly planarly applied, the graphite layer is compressed withoutbreakage, and the thermal diffusivity is not reduced. Thus, a graphitefilm can be obtained having a high thermal diffusivity and a highdensity and having no flaws and wrinkles on the surface. The film ispreferably heated during pressurization to more uniformly pressurize thefilm.

Examples of the vacuum press method include a method of pressurizing thefilm using a vacuum pressing machine such as a pressing machine, a hotpressing machine or a single-plate pressing machine provided with avacuuming function; a method of holding the graphite film by a plasticplate, a ceramic plate or a metal plate, bolting the film, and thenvacuuming the whole; and a method of uniformly pressurizing the graphitefilm such as vacuum rubber press in which the graphite film is held byrubber and pressure of the inside is reduced by vacuuming. In such amethod, pressure can be uniformly planarly applied, the air layercontained in the graphite film is compressed due to vacuuming, thegraphite layer is compressed without breakage, and the thermaldiffusivity is not reduced. Thus, a graphite film can be obtained havinga high thermal diffusivity and a high density and having no flaws andwrinkles on the surface. In performing vacuum press, vacuuming ispreferably carried out before pressurization. The film may have wrinkleswhen first pressurized; however, the graphite film is uniformlypressurized as a whole when first depressurized, so that a graphite filmhaving excellent quality without wrinkles can be obtained. Also in thismethod, the film is preferably heated during pressurization to moreuniformly pressurize the film. Such a graphite film is preferable,because the film has excellent thermal conductivity and thus heat isuniformly transferred to the film, and a flat graphite film havinguniformity in the plane can be obtained.

<Film-Like Medium>

Examples of the film-like medium other than the graphite film include agraphite film obtained from natural graphite, a resin film and metalfoil. Specific examples include a graphite film obtained from naturalgraphite, a shock-absorbing rubber material, an iron plate and a Teflon™film.

The term “together with a film-like medium” refers to the followingcases, for example: a case where films are sandwiched in the followingmanner: (a medium other than the graphite film/the one graphite film/amedium other than the graphite film/the one graphite film/a medium otherthan the graphite film/ . . . ), for example; and a case where films aresandwiched in the following manner: (a medium other than the graphitefilm/the multiple graphite films/a medium other than the graphitefilm/the multiple graphite films/a medium other than the graphite film/. . . ), for example.

<Independent Recovery Step>

The process for producing a graphite film according to the presentinvention preferably comprises the independent recovery step ofrecovering the multiple graphite films after the post-planarpressurization step as graphite films independent from each other.Specifically, the independent recovery step may be carried out by amethod of inserting a flat tip of a pincette into the interface betweenthe graphite films; or a method of gripping the edges of the two or morefilm-like media, respectively, and shifting the media parallel to theplane direction of the graphite films, for example. As described above,the present invention mainly aims to prepare graphite films independentfrom each other and does not aim to pressure bond two or more graphitefilms.

<Thickness, Density and Shape of Graphite Film>

The graphite film of the present invention may specifically have athickness of 20 μm or more, preferably 50 μm or more, and morepreferably 90 μm or more. When the thickness is 90 μm or more, theamount of heat transfer is increased, and thus heat easily escapes fromheat generating equipment and an increase in temperature can besuppressed. The graphite film of the present invention specifically hasa density of 1.2 g/cm³ or more, preferably 1.5 g/cm³ or more, and morepreferably 1.8 g/cm³. In this manner, the air layer contained in a spacebetween layers of the graphite film is reduced and the graphite film hasa uniformly high density. Therefore, a variation in thermal diffusivityis reduced, and a graphite film having excellent thermal diffusivity isobtained. Such a graphite film of the present invention does not haverecesses, flaws, longitudinal stripes and wrinkles on the surface.Therefore, contact of the film with a heat generation component or heatradiation component is improved, and the film can have excellent thermaldiffusivity as a graphite.

<Thermal Diffusivity of Graphite Film>

The graphite film of the present invention may have a thermaldiffusivity of 5.0×10⁻⁴ m²/sec or more, preferably 8.0×10⁻⁴ m²/sec, andmore preferably 9.0×10⁻⁴ m²/S. When the thermal diffusivity is 5.0×10⁻⁴m²/sec or more, thermal conductivity is high, and thus heat easilyescapes from heat generating equipment and an increase in temperature ofthe heat generating equipment can be suppressed.

Such a thermal diffusivity is an index of progression of graphitization.For example, as the film has a higher thermal diffusivity in the planedirection, graphitization is more significant. The thermal diffusivitycan be measured by a thermal diffusivity meter according to an AC method(“LaserPit” available from ULVAC-RIKO, Inc.) in an atmosphere at 20° C.at 10 Hz.

<Applications>

The graphite film of the present invention has high thermal conductivityand electrical conductivity, and is therefore suitable as a heatradiation material, a heat radiation component, a cooling component, atemperature control component or an electromagnetic shielding componentfor electronics such as servers, personal computer servers and desktoppersonal computers; portable electronics such as notebook personalcomputers, electronic dictionaries, PDAs, mobile telephones and personalmusic players; displays such as liquid crystal displays, plasmadisplays, LEDs, organic EL displays, inorganic EL displays, liquidcrystal projectors and watches; image-forming devices such as ink jetprinters and electrophotographic devices (developing devices, fixingdevices, heat rollers and heat belts); semiconductor-related componentssuch as semiconductor elements, semiconductor packages, semiconductorsealing cases, semiconductor die bonding, CPUs, memories, powertransistors and power transistor cases; wiring boards (including printedwiring boards) such as rigid wiring boards, flexible wiring boards,ceramic wiring boards, build-up wiring boards and multilayer substrates;production equipment such as vacuum treatment equipment, semiconductorproduction equipment and display production equipment; heat-insulatingdevices such as heat-insulating materials, vacuum heat-insulatingmaterials and radiation heat-insulating materials; data recordingdevices such as DVDs (optical pickups, laser generators and laserreceivers) and hard disk drives; image-recording devices such ascameras, video cameras, digital cameras, digital video cameras,microscopes and CCDs; and battery devices such as charging devices,lithium ion batteries and fuel cells, for example.

<Forms of Use>

When the graphite film of the present invention is actually used for aheating element, a heat sink, a heat pipe, a water cooler, a Peltierelement, an enclosure, a hinge and the like, the film preferably has anadhesive layer, a resin layer, a ceramic layer, a metal layer, aninsulating layer, a conductive layer and the like formed on one surfaceand/or both surfaces in order to improve fixability of the film to them,thermal diffusivity, heat radiation properties and handleability.

The reason why and the mechanism in which a graphite film obtained bythe process for producing a graphite film according to the presentinvention is superior in uniformity to a graphite film by a conventionalproduction process can be presumed as described above, although it isnecessary to further perform detailed academic research on the reasonand mechanism.

Various examples of the present invention will be described togetherwith some comparative examples. However, the present invention is notlimited to the examples.

EXAMPLES Preparation of Polyimide Film A

One equivalent of pyromellitic acid dianhydride was dissolved in asolution of 1 equivalent of 4,4-oxydianiline in DMF (dimethylformamide)to obtain a polyamide acid solution (18.5 wt %).

While cooling this solution, 1 equivalent of acetic acid anhydride, 1equivalent of isoquinoline and an imidization catalyst containing DMFwere added for a carboxylic acid group contained in polyamide acid tocarry out defoaming. Next, the mixed solution was applied to an aluminumfoil at a predetermined thickness after drying. Further, the mixedsolution layer on the aluminum foil was dried using a hot air oven and afar infrared heater.

The following drying method was used in preparing a film having a finalthickness of 75 μm or less, for example. The mixed solution layer on thealuminum foil was heated and dried in a hot air oven at 120° C. for 240seconds to once obtain a self-supporting gel film. Then, the gel filmwas separated from the aluminum foil and fixed to a frame. Further, thegel film fixed in the frame was heated stepwise in a hot air oven at120° C. for 30 seconds, at 275° C. for 40 seconds, at 400° C. for 43seconds and at 450° C. for 50 seconds and in a far infrared heater at460° C. for 23 seconds.

A polyimide film having a thickness of 75 μm and 125 μm (polyimide filmA: modulus of elasticity 3.1 GPa, water absorption 2.5%, birefringence0.10, coefficient of linear expansion 3.0×10⁻⁵/° C.) was prepared in theabove manner. When preparing a film having another thickness, the firingtime was controlled in proportion with the thickness. When preparing athick film, it is necessary to ensure a sufficient firing time at a lowtemperature in order to prevent foaming due to evaporation of thesolvent or imidization catalyst from the polyimide film.

In actual graphitization, a polyimide film of Apical AH manufactured byKaneka Corporation having a thickness of 75 μm and 125 μm was used whichwas prepared by the same method as above.

Method for Preparing Polyimide Film B

Four equivalents of pyromellitic acid dianhydride was dissolved in asolution of three equivalents of 4,4′-oxydianiline in DMF to synthesizea prepolymer having an acid anhydride at each terminal. A solutioncontaining the prepolymer was also obtained. Thereafter, 1 equivalent ofp-phenylenediamine was dissolved in the solution containing theprepolymer to obtain a polyamide acid solution.

A polyimide film having a thickness of 75 μm (polyimide film B: modulusof elasticity 4.1 GPa, water absorption 2.1%, birefringence 0.14,coefficient of linear expansion 1.6×10⁻⁵/° C.) was prepared in the samemanner as in the above <Preparation of polyimide film A> except forusing this polyamide acid solution.

In actual graphitization, a polyimide film of Apical NPI manufactured byKaneka Corporation having a thickness of 75 μm was used which wasprepared by the same method as above.

(Preparation of Carbonized Polymer Film)

The polyimide film A or B held in a graphite plate was placed in anelectric furnace, heated to 1,000° C. in a nitrogen atmosphere, andcarbonized by thermal treatment in this state for one hour to obtain acarbonized polymer film. In this manner, a carbonized polymer film A′was obtained from the polyimide film A having a thickness of 75 μm, acarbonized polymer film A″ was obtained from the polyimide film A havinga thickness of 125 μm, and a carbonized polymer film B′ was obtainedfrom the polyimide film B having a thickness of 75 μm.

The polyimide film A held in a graphite plate was placed in an electricfurnace, heated to 1,400° C. in a nitrogen atmosphere, and carbonized bythermal treatment in this state for one hour to obtain a carbonizedpolymer film. In this manner, a carbonized polymer film A′″ was obtainedfrom the polyimide film A having a thickness of 75 μm.

(Preparation of Graphite Film A)

The carbonized polymer film A′ was placed in a ultrahigh temperaturefurnace, heated to 2,800° C. in an argon atmosphere, maintained in thisstate for one hour, and then cooled to obtain a graphite film A.

(Preparation Method of Graphite Film A′)

The carbonized polymer film A′ was retained in a graphite container,covered with carbon powder containing coke as a main component, and thenfurther retained in an electrifiable graphite container and covered withcarbon powder. Thereafter, the film was heated to 3,000° C. not byatmospheric heating but by electrification of the container and carbonpowder as a whole by application of direct voltage to prepare a graphitefilm N.

(Preparation of Graphite Film B′)

The carbonized polymer film B′ was retained in a graphite container,covered with carbon powder containing coke as a main component, and thenfurther retained in an electrifiable graphite container and covered withcarbon powder. Thereafter, the film was heated to 3,000° C. not byatmospheric heating but by electrification of the container and carbonpowder as a whole by application of direct voltage to prepare a graphitefilm B′.

Comparative Example 1

The ten stacked carbonized polymer films A′ (length 200 mm×width 200 mm)were held by upper and lower flat graphite plates having a length of 270mm, a width of 270 mm and a thickness of 3 mm and retained in and incontact with a rectangular parallelepiped graphite container shown inFIG. 8. The stacked carbonized polymer films A′ were atmosphericallyheated to 3,000° C. with a graphite heater in an argon atmosphere underreduced pressure at 0.09 MPa, with pressure planarly applied to thefilms A′, and the films were maintained in this state for one hour.Then, the films were cooled to obtain graphite films. In this Example 1,the ten carbonized polymer films A′ as raw material films were retainedin the graphite container of FIG. 8, so that pressure planarly appliedto the stacked carbonized polymer films A′ in the graphitization stepwas automatically reduced.

Example 1

The one carbonized polymer film A′ was held by the upper and lower flatgraphite plates and retained in and in contact with a rectangularparallelepiped graphite container shown in FIG. 8, so that pressure wasplanarly applied to the carbonized polymer film A′. The graphitecontainer was covered with carbon powder containing coke as a maincomponent, and the container and carbon powder as a whole wereelectrically heated to 3,000° C. by application of direct voltage toprepare a graphite film. In Example 2, a graphite container of FIG. 8was used for retaining the raw material film. Thus, pressure planarlyapplied to the carbonized polymer film A′ was reduced in part of thegraphitization step.

Example 2

Graphite films were prepared in the same manner as in Example 1, exceptthat the ten carbonized polymer films A′ were stacked.

Example 3

Graphite films were prepared in the same manner as in Example 1, exceptthat the thirty carbonized polymer films A′ were stacked.

Example 4

Graphite films were prepared in the same manner as in Example 1, exceptthat the one hundred carbonized polymer films A′ were stacked.

Example 5

The ten carbonized polymer films A′ were stacked, held by a graphite jigshown in FIG. 9, retained in and in contact with a graphite container ofFIG. 2 in this state, and electrified in the same manner as in Example 1to prepare graphite films. Since the stacked films were held by thegraphite film as shown in FIG. 9, pressure planarly applied to the filmswas not reduced in the graphitization step.

Example 6

Graphite films were prepared in the same manner as in Example 1, exceptthat the ten carbonized polymer films A′ were stacked and retained inand in contact with a graphite container with pressure notanisotropically applied to the stacked carbonized polymer films A′.

Example 7

Graphite films were prepared in the same manner as in Example 1, exceptthat the ten carbonized polymer films A″ were stacked.

Example 8

Graphite films were prepared in the same manner as in Example 1, exceptthat the thirty carbonized polymer films A′″ were stacked.

Example 9

Graphite films were prepared in the same manner as in Example 1, exceptthat the thirty carbonized polymer films A′ were stacked and a carbonmaterial having a height with a parameter H of 0.6 with respect to thestacking thickness of the stacked carbonized polymer films A′ waspresent around the raw material films.

Example 10

Graphite films were prepared in the same manner as in Example 1, exceptthat the ten carbonized polymer films B′ were stacked.

Example 11

A graphite film was prepared in the same manner as in Example 1, exceptthat the one polymer film A was used as a raw material film.

Comparative Example 2

The one carbonized polymer film A′ was retained in a graphite containerwith pressure not anisotropically applied to the film, heated to 3,000°C. in an argon atmosphere under reduced pressure at 0.09 MPa using aultrahigh temperature furnace with a graphite heater, and maintained atthat highest temperature for one hour. Thereafter, the film was cooledto obtain a graphite film. The graphite film obtained in this manner hadwrinkles and inferior flatness.

Comparative Example 3

The one carbonized polymer film A′ was held by a graphite jig shown inFIG. 9, retained in a graphite container of FIG. 2 with pressureplanarly applied to the carbonized polymer film not reduced in thegraphitization step, and atmospherically heated in the same manner as inComparative Example 1 to prepare a graphite film. The graphite filmobtained in this manner was broken and the thermal diffusivity could notbe measured.

The thermal diffusivity of the graphite films obtained in Examples 1 to11 and Comparative Examples 1 to 3 is shown in Table 1.

TABLE 1 Raw material film (polymer film or Raw Pressure to Numbercarbonized film) Raw material stacked of Thickness Thermal Removabilitymaterial film thickness film size carbonized stacked of graphitediffusivity Flatness of of films from Example in parentheses (*1) (cm²)Heating method films film(s) film/μm (×10⁻⁴ m²/sec) film each otherComparative A′ (75 μm) 400 Atmospheric Present (*2) 10 40 8.8 Good GoodExample 1 heating Example 1 A′ (75 μm) 400 Electrical heating Present(*2) 1 36 9.8 Very good — Example 2 A′ (75 μm) 400 Electrical heatingPresent (*2) 10 34 10.3 Very good Good Example 3 A′ (75 μm) 400Electrical heating Present (*2) 30 33 10.6 Very good Good Example 4 A′(75 μm) 400 Electrical heating Present (*2) 100 34 10.6 Very good GoodExample 5 A′ (75 μm) 400 Electrical heating Present (*3) 10 35 10.4 GoodGood Example 6 A′ (75 μm) 400 Electrical heating None 10 36 10.0 GoodVery good Example 7 A″ (125 μm) 400 Electrical heating Present (*2) 1057 10.0 Very good Good Example 8 A′″ (75 μm) (*4) 400 Electrical heatingPresent (*2) 30 34 10.6 Very good Good Example 9 A′ (75 μm) 400Electrical heating Present (*5) 30 34 10.5 Very good Very good Example10 B′ (75 μm) 400 Electrical heating Present (*2) 10 35 10.8 Very goodGood Example 11 A′ (75 μm) 400 Electrical heating Present (*2) 1 35 9.5Good — Comparative A′ (75 μm) 400 Atmospheric None 1 32 8.2 Poor —Example 2 heating (wrinkles) Comparative A′ (75 μm) 400 AtmosphericPresent (*3) 1 — — Broken — Example 3 heating (*1) The raw materialthickness in the table represents a thickness of a polyimide film beforecarbonization, that is, an uncarbonized polyimide film. (*2) The casewhere the raw material film was retained in a graphite container thatcan reduce planar pressure to the raw material film in thegraphitization step shown in FIG. 8. (*3) The case where the rawmaterial film was retained in a graphite jig that can reduce planarpressure to the raw material film in the graphitization step shown inFIG. 9. (*4) The highest carbonization treatment temperature in Example8 was 1,400° C. Further, the highest carbonization treatment temperaturein Examples 1 to 7, 9 and 10 and Comparative Examples 1 to 3 was 1,000°C. (*5) The raw material films were graphitized with a carbon materialaround the raw material films, the carbon material having a heightsmaller than the stacking height of the raw material films.

The thermal diffusivity by electrical heating in Examples 1 to 11 washigher than that by atmospheric heating in Comparative Examples 1 to 3and was 9.5×10⁻⁴ m²/sec or more, and graphite films having excellentflatness were obtained in Examples 1 to 11. The graphite films obtainedby electrical heating were more excellent than those obtained byatmospheric heating, presumably because the raw material films can beuniformly heated by electrical heating rather than atmospheric heating,as described above.

Even when thick raw material films were stacked as in Example 7,graphite films having a thermal diffusivity of 10.0×10⁻⁴ m²/sec could beobtained with excellent flatness.

In Comparative Examples 1 to 3 with atmospheric heating, excellentgraphite films were obtained in Example 1 in which raw material filmswere stacked. The graphite film of Comparative Example 3 was broken butthe graphite films of Comparative Example 1 were not broken, wherepressure was applied to the raw material film(s) during thegraphitization step. This is because breakage of the graphite filmscould be prevented in Comparative Example 1 by stacking raw materialfilms to increase cushioning against pressure to the raw material films,while a single raw material film was used in Comparative Example 3. Inaddition, the thermal diffusivity in Comparative Example 1 was higherthan that in Comparative Example 2, presumably because development ofthe graphite layer in the plane direction of the raw material film waspromoted by applying pressure in the plane direction during thegraphitization step.

<Effect of Stacking in Graphitization Step>

In Example 1 where a single raw material film was graphitized andExamples 2 to 4 where two or more stacked raw material films weregraphitized, the raw material film itself was electrically heated andplanarly pressurized to carry out the graphitization step, respectively.The graphite films of Examples 2 to 4 obtained from two or more stackedfilms were superior in thermal diffusivity to the graphite film ofExample 1. This is presumably because the percentage of the raw materialfilms occupied in a container was increased by stacking as compared withthe case where a single raw material film was used; the raw materialfilms were more electrified than the container as the films weregraphitized; and therefore graphitization of the raw material films waspromoted. As is clear from Examples 2 to 4, when a certain number ormore of the films were stacked, there was no significant difference inthermal diffusivity according to the number of stacked films. Thissuggests that uniform heating to a certain extent was realized bystacking two or more films. Further, in Example 8 in which thecarbonization temperature of the raw material polymer films was 1,400°C., the resulting graphite films had a thermal diffusivity similar tothat of the graphite films of Example 3 in which the carbonizationtemperature was 1,000° C. The resulting graphite films had a similarthermal diffusivity presumably due to the effect of stacking rawmaterial films.

The graphite films of Example 10 have most superior in thermaldiffusivity among those of Examples 1 to 11, presumably because thestarting material is produced by sequence control, and thus has highplane orientation to make molecular rearrangement easily occur duringgraphitization; and development of the graphite layer is promoted in theplane direction by applying pressure planarly in the graphitizationstep.

<Representation of Evaluation Results for Flatness and Removability>

Flatness and removability of the graphite films were evaluated. Table 1shows the evaluation results by visual observation for flatness of thegraphite films obtained in each example. In this table, the graphitefilms relatively flat without waviness were evaluated as “good”, thegraphite films particularly excellent were evaluated as “very good”, andthe graphite films having large waviness were evaluated as “poor”.Removability of the resulting stacked graphite films from each other wasevaluated as follows. The films that can each be removed withoutbreakage and independently recovered were evaluated as “good”, the filmsthat can each be recovered without requiring a removal step wereevaluated as “very good”, the films partially broken when removed wereevaluated as “fair”, and the films adhered to each other and completelybroken when removed were evaluated as “poor”.

<Planar Pressure Reduction>

As shown in Table 1, the resulting graphite films in all Examples hadexcellent flatness. Graphite films having particularly excellentflatness were obtained by electrically heating the raw material filmitself and thermally treating the film with pressure planarly applied tothe film, and furthermore appropriately reducing the planar pressure inthis planar pressurization during the thermal treatment in thegraphitization step, as in Examples 1 to 4 and 7 to 10. This ispresumably because expansion of the raw material film in the planedirection according to graphitization in the middle of thegraphitization step more easily occurs by this planar pressurereduction.

In all Examples in which raw material films were stacked, the resultingstacked graphite films could be each independently recovered withoutbreakage and were not adhered to each other during the graphitizationstep. In particular, the graphite films obtained in Examples 6 and 9could be each independently recovered without requiring a removal step.This is presumably because the stacked raw material films were thermallytreated with planar pressure not applied to the films in Example 6, andthe stacked raw material films were thermally treated with a carbonmaterial present around the films in Example 9, making it possible toprevent application of excessive pressure.

A graphite film obtained through such a graphitization step of thepresent invention is flexible, but a more flexible graphite film can beprepared by further compressing or rolling the resulting graphite film.

The post-planar pressurization step of the present invention will beparticularly described below in detail as an example of the compressiontreatment or rolling treatment.

Comparative Example 4

The graphite film A after the graphitization step was pressurized at apressure of 0.2 MPa at room temperature using single-plate press tocarry out the post-planar pressurization step, with both surfaces of thefilm held by a polyimide film, a Teflon® film, a shock-absorbing rubbermaterial and an iron plate. The held polyimide film was removed afterthe single-plate press step to recover the graphite film A after thepost-planar pressurization step as an independent graphite film.

Comparative Example 5

The graphite film A after the graphitization step was first vacuumed andthen pressurized at a pressure of 0.2 MPa at room temperature usingvacuum press, with both surfaces of the film held by a polyimide film, aTeflon® film, a shock-absorbing rubber material and an iron plate. Theheld polyimide film was removed after the vacuum press step to recoverthe graphite film A after the post-planar pressurization step as anindependent graphite film.

Example 12

The graphite film A′ was pressurized at a pressure of 0.2 MPa at roomtemperature using single-plate press, with both surfaces of the filmheld by a polyimide film, a Teflon® film, a shock-absorbing rubbermaterial and an iron plate. The held polyimide film was removed afterthe single-plate press step to recover the graphite film A′ after thepost-planar pressurization step as an independent graphite film.

Example 13

The graphite film A′ was pressurized by vacuuming at room temperatureusing vacuum rubber press, with both surfaces of the film held by apolyimide film. The held polyimide film was removed after the vacuumrubber press step to recover the graphite film A′ after the post-planarpressurization step as an independent graphite film.

Example 14

The graphite film A′ was first vacuumed and then pressurized at apressure of 0.2 MPa at room temperature using vacuum press, with bothsurfaces of the film held by a polyimide film, a Teflon® film, ashock-absorbing rubber material and an iron plate. The held polyimidefilm was removed after the vacuum press step to recover the graphitefilm A′ after the post-planar pressurization step as an independentgraphite film.

Example 15

The graphite film B′ was first vacuumed and then pressurized at apressure of 0.2 MPa at room temperature using vacuum press, with bothsurfaces of the film held by a polyimide film, a Teflon® film, ashock-absorbing rubber material and an iron plate. The held polyimidefilm was removed after the vacuum press step to recover the graphitefilm B′ after the post-planar pressurization step as an independentgraphite film.

Example 16

The graphite film A′ was first vacuumed and then pressurized at apressure of 0.2 MPa at 100° C. using vacuum press, with both surfaces ofthe film held by a polyimide film, a Teflon® film, a shock-absorbingrubber material and an iron plate. The held polyimide film was removedafter the vacuum press step to recover the graphite film A′ after thepost-planar pressurization step as an independent graphite film.

Example 17

The thirty graphite films A′ were pressurized at a pressure of 0.2 MPaat room temperature using single-plate press, with both surfaces of thefilms held by a polyimide film, a Teflon® film, a shock-absorbing rubbermaterial and an iron plate. The thirty graphite films were recoveredafter the single-plate press step as the thirty independent graphitefilms A′ after the post-planar pressurization step.

Example 18

The thirty graphite films A′ were first vacuumed and then pressurized ata pressure of 0.2 MPa at room temperature using vacuum press, with bothsurfaces of the films held by a polyimide film, a Teflon® film, ashock-absorbing rubber material and an iron plate. The thirty graphitefilms were recovered after the vacuum press step as the thirtyindependent graphite films A′ after the post-planar pressurization step.

Example 19

The thirty graphite films A′ and twenty-nine graphite sheets obtainedfrom natural graphite were alternately placed and were first vacuumedand then pressurized at a pressure of 0.2 MPa at room temperature usingvacuum press, with both surfaces of the whole held by a polyimide film,a Teflon® film, a shock-absorbing rubber material and an iron plate. Thealternately placed graphite sheets were removed after the vacuum pressstep to recover the thirty graphite films as the thirty independentgraphite films A′ after the post-planar pressurization step.

Example 20

The thirty graphite films A′ and twenty-nine polyimide films werealternately placed and were first vacuumed and then pressurized at apressure of 0.2 MPa at room temperature using vacuum press, with bothsurfaces of the whole held by a polyimide film, a Teflon® film, ashock-absorbing rubber material and an iron plate. The alternatelyplaced polyimide films were removed after the vacuum press step torecover the thirty graphite films as the thirty independent graphitefilms A′ after the post-planar pressurization step.

Comparative Example 6

The graphite film A was rolled through two metal pressure rollers toobtain a graphite film.

The thermal diffusivity of the graphite films obtained in Examples 12 to20 and Comparative Examples 4 to 6 is shown in Table 2. Properties of agraphite film manufactured by Matsushita Electric Industrial Co., Ltd.(EYGS182510) are also shown as Reference Example.

TABLE 2 Thermal Appearance Graphitization Processing diffusivity DensityFlaws and Example Raw material film method method (10⁻⁴ m²/S) (g/cm³)wrinkles Recesses Flatness Comparative 75 μm polyimide film AAtmospheric heating Press 7.4 1.60 Good Fair Good Example 4 Comparative75 μm polyimide film A Atmospheric heating Vacuum press 7.6 1.75 GoodFair Very good Example 5 Example 12 75 μm polyimide film A′ Electricalheating Press 9.5 1.80 Good Good Good Example 13 75 μm polyimide film A′Electrical heating Vacuum rubber 9.7 1.80 Good Good Very good pressExample 14 75 μm polyimide film A′ Electrical heating Vacuum press 9.81.85 Good Good Very good Example 15 75 μm polyimide film B′ Electricalheating Vacuum press 10.0 1.88 Good Good Very good Example 16 75 μmpolyimide film A′ Electrical heating Vacuum press 10.2 1.90 Good GoodVery good at 100° C. Example 17 75 μm polyimide film A′ Electricalheating Press after 9.5 1.80 Very good Good Good stacking Example 18 75μm polyimide film A′ Electrical heating Vacuum press 9.8 1.90 Very goodGood Very good after stacking Example 19 75 μm polyimide film A′Electrical heating Vacuum press 9.6 1.80 Very good Good Very good afterstacking Example 20 75 μm polyimide film A′ Electrical heating Vacuumpress 9.8 1.90 Very good Good Very good after stacking Comparative 75 μmpolyimide film A Atmospheric heating Rolling by 7.1 1.10 Poor Poor FairExample 6 metal rollers Reference Graphite film manufactured byMatsushita Electric 7.1 1.10 Fair Poor Fair Example Industrial Co., Ltd.

Flaws and wrinkles of the graphite films were evaluated by visualobservation. The graphite films without flaws and wrinkles wereevaluated as “Good”, the graphite films particularly excellent wereevaluated as “Very Good”, the graphite films having either linear flawsor wrinkles observed were evaluated as “Fair”, and the graphite filmshaving both linear flaws and wrinkles observed were evaluated as “Poor”.

Recesses of the graphite films were evaluated by visual observation. Thegraphite films not recessed were evaluated as “Good”, the graphite filmspartially recessed were evaluated as “Fair”, and the graphite filmswholly recessed were evaluated as “Poor”.

Flatness of the graphite films was evaluated by visual observation. Thegraphite films flat without waviness were evaluated as “good”, thegraphite films particularly excellent were evaluated as “very good”, thegraphite films having waviness observed were evaluated as “fair”, andthe graphite films having large waviness were evaluated as “poor”.

The graphite films obtained in Examples 12 to 20 each had a thermaldiffusivity of 9.5×10⁻⁴ m²/sec or more and thus had high thermalconductivity. On the other hand, the graphite films obtained inComparative Examples 4 to 6 and Reference Example each had a thermaldiffusivity of 7.6×10⁻⁴ m²/sec or less which was inferior to those inExamples 12 to 20.

In particular, the graphite films of Comparative Examples 4 and 5 weresuperior in thermal diffusivity to that of Comparative Example 6,presumably because the film was rolled through metal rollers inComparative Example 6 to apply shear force to the film, so that thegraphite layer was broken and the thermal diffusivity was reduced, whilethe films were planarly pressurized in Comparative Examples 4 and 5, sothat the graphite layer was not broken and was planarly stretched toprovide the films with an excellent thermal diffusivity in the planedirection.

The graphite film of Comparative Example 5 was superior in thermaldiffusivity to that of Comparative Example 4, presumably because thefilm was pressurized using vacuum press in Comparative Example 5, sothat air between layers of the graphite was removed and the air heatinsulation layer was reduced.

The graphite films obtained in Examples 12 to 20 were superior inthermal diffusivity to the graphite films obtained in ComparativeExamples 4 and 5. In these Examples, the film was retained in anelectrifiable container and graphitized with the container electrifiedby application of voltage. As a result, since the raw material film wasalso electrically heated, the inside and the surface of the film wereuniformly heated due to contribution of heat generation of the rawmaterial film itself, and the film was sufficiently uniformly heatedfrom the periphery of the film. Therefore, the graphite layer was grownmore significantly than in the conventional art, and a graphite filmhaving excellent electrical conductivity and thermal conductivity couldbe obtained, presumably. On the other hand, in Comparative Examples 4 to6, since the raw material film was heated in an inert gas atmosphere,heating is carried out from the surface of the film by heat conductionfrom a part in contact with a heater or atmospheric gas or radiationheat from a heater, so that the inside and the surface of the film wasnon-uniformly graphitized and thermal conductivity of the whole film wasreduced, presumably.

The graphite film obtained in Example 15 was superior to the graphitefilm obtained in Example 14. The graphite film of Example 15 wassuperior, presumably because the starting material of Example 15 hadhigher plane orientation and was produced by sequence control, so thatmolecular rearrangement easily occurs during graphitization. Further,since the starting material had a higher carbon ratio as the startingmaterial had a higher degree of plane orientation, the amount ofdecomposition gas was small and the starting material was smoothlygraphitized, presumably.

The graphite films obtained in Examples 12 to 20 had a density higherthan those of the graphite films obtained in Comparative Examples 4 to 6and Reference Example. In addition, the graphite films had a smallvariation in density in the plane.

In particular, the graphite films of Comparative Examples 4 and 5 had adensity higher than to that of Comparative Example 6, presumably becausethe graphite film was rolled through two metal rollers in ComparativeExample 6, so that the film was linearly pressurized from up and downand could not be compressed on the whole surface, making it difficult toincrease the density, while the films were planarly pressurized inComparative Examples 4 and 5, so that the graphite layer was not brokenand was planarly stretched, making it possible to obtain graphite filmshaving a high density.

The graphite film of Comparative Example 5 was superior in density tothat of Comparative Example 4, presumably because the film waspressurized using vacuum press in Comparative Example 5, so that airbetween layers of the graphite was effectively removed.

The graphite films obtained in Examples 12 to 20 had a density higherthan those of the graphite films obtained in Comparative Examples 4 and5. In these Examples, since the films were graphitized whileelectrified, graphite films could be obtained with a graphite layergrown further than in conventional graphite films, presumably. As aresult, when the graphite film having a graphite layer grown wasplanarly pressurized, the graphite layer was effectively planarlywidened and a graphite film having a high density was obtained,presumably.

The graphite films obtained in Comparative Examples 4 and 5 and Examples12 to 20 had flaws and wrinkles on the surface fewer than in thegraphite films obtained in Comparative Example 6 and Reference Example.

In particular, the graphite films of Comparative Examples 4 and 5 hadflaws and wrinkles fewer than in the graphite film of ComparativeExample 6, because the graphite films were rolled through two metalrollers to apply shear force to the films by linear pressurization fromup and down, so that the graphite films easily had wrinkles in a partwhere strength in the plane significantly varied. The films had flawsoriginating from partial wrinkles in some cases. Further, in rollingtreatment with the rollers, the graphite films were removed and theremoved graphite films were attached to the rollers, so that thegraphite films had flaws during rolling in some cases.

In Examples 7 to 20, graphite films not defected without flaws andwrinkles were obtained. This is presumably because the graphite filmswere cushioning materials uniformly pressurized in the plane,presumably.

The graphite films obtained in Comparative Examples 4 and 5 and Examples12 to 20 had recesses fewer than in the graphite films obtained inComparative Example 6 and Reference Example. Further, the graphite filmsobtained in Examples 12 to 20 had recesses fewer than in the graphitefilms obtained in Comparative Examples 4 and 5.

In Comparative Examples 4 to 6, since the films were heated in an inertgas atmosphere, the inside and the surface of the films werenon-uniformly graphitized; growth of the graphite layer partiallyvaried; and partial defects easily occurred due to decomposition gasgenerated or rearrangement during graphitization. Therefore, even afterrolling treatment and pressurization treatment, the films were generallyflat but had recesses at a depth of 1 mm or less visually observed.

On the other hand, in Examples 12 to 20, since the films weregraphitized by electrification, the graphite films had a graphite layergrown in the plane more uniformly than in conventional graphite films,and recesses were not generated even after rolling or pressurizationtreatment, so that graphite films without recesses could be obtained.

The graphite films of Comparative Examples 4 and 5 had recesses fewerthan in the graphite film of Comparative Example 6, because the graphitefilm of Comparative Example 6 was rolled through two metal rollers toapply shear force to the film by linear pressurization from up and down,so that recesses could not be eliminated. On the other hand, when thefilms were planarly pressurized, recesses were filled and thusinvisible, presumably.

The graphite films obtained in Examples 12 to 20 were superior inflatness to the graphite films obtained in Comparative Example 6 andReference Example. Further, the graphite films obtained in ComparativeExample 5, Examples 13 to 16 and Examples 18 to 20 had particularlyexcellent flatness.

The graphite films of Comparative Examples 4 and 5 were superior inflatness to the graphite film of Comparative Example 6, because thegraphite film of Comparative Example 6 was rolled through two metalrollers to apply shear force to the film by linear pressurization fromup and down. The graphite film had inferior strength and was supportedby two upper and lower points of the rollers during rolling, so that thefilm was easily distorted after rolling treatment. On the other hand,since the whole surface of the film was fixed during planarpressurization, a graphite film having excellent flatness withoutdistortion could be easily obtained.

The graphite films of Comparative Example 5, Examples 13 to 16 andExamples 18 to 20 had particularly excellent flatness, presumablybecause the whole films were uniformly pressurized by performing vacuumtreatment before pressurization.

In the case of vacuum press, a graphite film having excellent flatnesswithout flaws, recesses and wrinkles on the surface could be obtained bycarrying out first vacuuming and then pressurization rather thancarrying out vacuuming and pressurization at the same time.

The graphite film prepared in Example 5 and the graphite film ofComparative Example 7 described later were tested for the thickness,thickness variation, density, surface roughness Ra, coefficient oflinear expansion, tensile strength and tensile modulus of elasticity,thermal diffusivity in the plane direction according to an AC method,thermal diffusivity and thermal conductivity in the thickness directionby a laser flash method, thermal resistance and thermal conductivity inthe thickness direction by a thermal resistance measuring apparatus, MITflexural fatigue resistance, pencil hardness and winding around apencil, and were observed using a cross-sectional SEM image.

Comparative Example 7

The graphite film of Example 7 was a commonly available PGS graphitesheet “EYGS182310” manufactured by Matsushita Electric Industrial Co.,Ltd. and was presumably a film obtained by graphitizing KAPTON® 300H, apolyimide film manufactured by Du Pont-Toray Co., Ltd., by atmosphericheating, according to the description of a known document or the like.

(Thickness, Thickness Variation and Density)

The thickness of any points of the graphite film was measured by MT1201and ND221B manufactured by Heidenhain Corporation. The thickness of thegraphite film was an average of measured values at any ten points, andthe difference between the highest value and the lowest value amongthickness values at any twenty points was a variation in thickness. Thedensity of the graphite film was calculated by dividing the weight (g)of the graphite film by the volume (cm³) of the graphite film calculatedas a product of the length, width and thickness of the film. As thedensity is higher, graphitization is assumed to be more significant. Thegraphite film prepared in Example 5 had a variation in thickness of 2.5μm and a density of 1.9 g/cm³, and the graphite film of ComparativeExample 7 had a thickness of 65 μm, a variation in thickness of 11.3 μmand a density of 1.2 g/cm³.

(Surface Roughness Ra)

The surface roughness Ra of the graphite film was a value obtainedaccording to JIS B0601 and was specifically measured using a surfaceroughness measuring instrument SE3500 (manufactured by Kosaka LaboratoryLtd.). Specifically, the graphite film was cut into a length of 100m×m×a width of 200 mm, and a chart was drawn with a cutoff of 0.8 mm anda chart speed of 2 mm/s. A part having a reference length L wasextracted from the chart. The surface roughness is a value obtained bythe following formula 5 in μm units when the roughness curve isrepresented by Y=f(X) where the X axis represents the center line of theextracted part and the Y axis represents the longitudinal direction ofthe extracted part. This measurement was carried out three times with areference length (L) of 80 mm and the average was determined as asurface roughness Ra. As the value of surface roughness Ra is smaller,the graphite film has more excellent surface flatness. The graphite filmof the present invention has a surface roughness Ra of preferably 2.5 μmor less, and more preferably 2.5 μm or less, taking into considerationadhesion to the heat generation site and adhesion of the complexedgraphite film to the complexed layer. The graphite film prepared inExample 5 had a surface roughness Ra of 2.3 μm, and the graphite film ofComparative Example 7 had a surface roughness Ra of 2.9 μm.

[Formula 5]

Ra=(1/L)∫^(L) |f(X)|dx  (5)

(Coefficient of Linear Expansion)

The coefficient of linear expansion in the plane direction of thegraphite film was measured using a thermomechanical analyzer TMA-50manufactured by Shimadzu Corporation. Specifically, the coefficient of agraphite film sample cut into a length of 3×20 mm was measured in atensile mode in a nitrogen atmosphere at an initial loading of 10 g,with the sample heated from room temperature to 400° C. at a heatingrate of 10° C./min. The average of values at 100° C. to 200° C. was usedas a representative coefficient of linear expansion. The graphite filmprepared in Example 5 had a coefficient of linear expansion of −1.8 ppm,and the graphite film of Comparative Example 7 had a coefficient oflinear expansion of 0.1 ppm.

(Tensile Strength and Tensile Modulus of Elasticity)

The tensile strength and tensile modulus of elasticity of the graphitefilm were measured three times in accordance to ASTM-D-882 at roomtemperature with a distance between chucks of 100 mm and a tensile speedof 50 mm/min, using Strograph VES1D manufactured by Toyo SeikiSeisaku-Sho, Ltd.; the average of three measured values was used as ameasurement result. The graphite film prepared in Example 5 had atensile strength of 27.5 MPa and a tensile modulus of elasticity of 1.2GPa, and the graphite film of Comparative Example 7 had a tensilestrength of 20.0 MPa and a tensile modulus of elasticity of 0.7 GPa.

(Thermal Diffusivity in Plane Direction According to AC Method)

The progression of graphitization can be evaluated based on the thermaldiffusivity in the plane direction of the film. As the thermaldiffusivity is higher, graphitization is more significant. In thepresent application, the thermal diffusivity was be measured using athermal diffusivity meter according to an AC method (“LaserPit”available from ULVAC-RIKO, Inc.). Specifically, the graphite film wascut into a 4×40 mm sample and the thermal diffusivity was measured in anatmosphere at 20° C. at 10 Hz. The graphite film prepared in Example 5had a thermal diffusivity in the plane direction of 10.0×10⁻⁴ m²/s, andthe graphite film of Comparative Example 4 had a thermal diffusivity inthe plane direction of 7.2×10⁻⁴ m²/s.

(Thermal Diffusivity and Thermal Conductivity in Thickness Direction byLaser Flash Method)

The thermal diffusivity and thermal conductivity in the thicknessdirection of the graphite film were measured by a laser flash methodusing LFA-502 manufactured by Kyoto Electronics Manufacturing Co., Ltd.in accordance with JIS R1611-1997. Specifically, the graphite film wascut into a diameter of 10 mm, both surfaces of the film were blackened,and then the thermal diffusivity and thermal conductivity were measuredat room temperature. The heat capacity of the graphite film wascalculated from comparison with a reference standard substance Mo havinga known heat capacity. The thermal conductivity in the thicknessdirection of the graphite film was calculated from the results ofmeasuring the thermal diffusivity in the thickness direction, thedensity and the heat capacity of the graphite film. The graphite filmprepared in Example 5 had a thermal diffusivity in the thicknessdirection of 4.8 mm²/s and a thermal conductivity in the thicknessdirection of 6.8 W/m·K, and the graphite film of Comparative Example 4had a thermal diffusivity in the thickness direction of 8.6 mm²/s and athermal conductivity in the thickness direction of 7.8 W/m·K.

(Thermal Resistance and Thermal Conductivity in Thickness Direction)

The thermal resistance and thermal conductivity in the thicknessdirection of the graphite film were measured using a resin materialthermal resistance measuring apparatus I-Engineering manufactured byHitachi, Ltd., under conditions where the graphite film was cut into a10 mm square and held between mirror surfaces of a 0.525 mm-thicksilicon chip; oil was applied between a heating shaft and a coolingshaft; the sample temperature was 50° C.; and a constant loading mode at20 N was used. The thermal resistance in the thickness direction of thefilm can be measured in a contact manner by this method. The thermalresistance was an average of three measurement values, and the thermalconductivity in the thickness direction was calculated from the value.The graphite film prepared in Example 5 had a thermal resistance in thethickness direction of 0.48° C./W and a thermal conductivity in thethickness direction of 1.1 W/m·K, and the graphite film of ComparativeExample 7 had a thermal resistance in the thickness direction of 0.53°C./W and a thermal conductivity in the thickness direction of 1.6 W/m·K.

(MIT Flexural Fatigue Resistance)

An MIT flexural fatigue resistance test was carried out for the graphitefilm. Specifically, the test was carried out for the graphite film cutinto 1.5×10 cm using an MIT flexural fatigue resistance tester type-Dmanufactured by Toyo Seiki Seisaku-Sho, Ltd. with a test load of 100 gf(0.98 N), a speed of 90 times/min and a bending radius R of 5 mm. Thebending angle in the test was 45° in the transverse direction. Thegraphite film prepared in Example 5 and the graphite film of ComparativeExample 7 were both tested 10,000 times or more until being cut.

(Pencil Hardness)

The pencil hardness of the graphite film was evaluated according to8.4.1 Testing machine method in “Testing methods for paints” of JIS K5400 (1990) (JIS K 5600 (1999)). The evaluation value was represented bya pencil hardness such as 2B, B, HB or H. The surface hardness is higherin this order. The graphite film prepared in Example 5 has a pencilhardness of HB or higher and thus has high surface hardness.

(Test for Winding Around Pencil)

Winding of the graphite film around a pencil was tested in order toexamine flexibility of the graphite film. Specifically, the graphitefilm was cut into 3×5 cm and wound around a pencil having a diameter of7 mm with a round cross-sectional shape. The cut graphite film was woundin the 5 cm long side direction around the pencil to the last, and thenappearance of the film was visually observed. The film not broken wasevaluated as “windable”, and the film broken was evaluated as “notwindable”. The graphite film prepared in Example 5 and the graphite filmof Comparative Example 7 were both “windable”.

(Cross-Sectional SEM Image Observation)

A cross-sectional SEM image of the graphite film was observed using ascanning electron microscope S-4500 manufactured by Hitachi, Ltd. at anacceleration voltage of 5 kV. A sample for the image was prepared asfollows. The graphite film was cut into a strip having a length of 20 mmand a width of 10 mm with a cutter knife. Then, a tiny incision was madeon one edge of the cut film in the plane direction with a razor. Forcewas applied to the incision from the opposed side of the film to cut theincision off, thereby revealing the cross-section of the film.

FIG. 10 shows a cross-sectional SEM image of the graphite film ofExample 5. In the whole film plane of the graphite film of Example 1,the surface layer has a structure in which single graphite layers areeach formed to have an approximately rectangular shape with a short sidelength of 5 μm or more by stacking approximate rectangles each having athickness of less than 1 μm approximately parallel to each other, andthe single graphite layers are extremely densely stacked to have anapproximately rectangular shape with a short side length of 10 μm ormore, that is, have a thickness of 10 μm or more. Specifically, thesurface layer has a cross-sectional pattern as a dense graphite layerwhich has graphite crystallites developed in the plane direction andstacked, and a layer other than the surface layer has a cross-sectionalpattern as a graphite layer which has graphite crystallites developed inthe plane direction but not stacked and is rich in air layers. That is,the graphite film of the present invention includes a graphite filmhaving a part with a surface layer and a layer other than the surfacelayer differing at least in cross-sectional pattern. Due to thisstructure, the graphite film of the present invention has high thermalconductivity, and has excellent crystallinity of the graphite layer sothat the film has a density of 1.9 g/cm³ or more which is higher thanthat of the graphite film of Comparative Example 7.

On the other hand, the graphite film of Comparative Example 7 ispresumably prepared by thermally treating a polyimide film as a rawmaterial. However, as is shown in FIG. 11 which is a cross-sectional SEMimage of the graphite film, graphite crystallites are developed in theplane direction but are almost present as single layers and not stacked,and the film is wavy and has a low density.

As described above, the graphite film of the present invention has acoefficient of linear expansion of 0 ppm or less, a tensile modulus ofelasticity of 1 GPa or more, and a thermal conductivity in the contactthickness direction of 1.4 W/m·K or less measured by a thermalresistance measuring apparatus. Therefore, when used for a heat sink orthe like, the dimension of the graphite film is not changed even by achange in temperature during heating or cooling of a heat generationcomponent; the film has sufficient strength even if the film is thin;the film can rapidly transfer heat from a heat generation component;graphite can be prevented from being removed from the surface.Therefore, the film provides a heat radiation component with highadhesion to a pressure sensitive adhesive, an adhesive or a heatgeneration component, with low pollution and with no flaws on thesurface. In particular, since the graphite film of the present inventionhas a coefficient of linear expansion of 0 ppm or less, the film cancompensate thermal expansion when bonded to one or more common materialshaving a coefficient of linear expansion of 0 ppm or more. Further,since thermal diffusivity in the plane direction and thermal diffusivityin the thickness direction are considerably anisotropic and the thermaldiffusivity is more excellent in the plane direction than in thethickness direction, the film can diffuse heat from a heat generationpart preferentially in the plane direction and can suppress generationof heat spots.

1. A process for producing a graphite film comprising a step ofgraphitizing a raw material film made of a polymer film and/or acarbonized polymer film and a post-planar pressurization step forplanarly pressurizing the graphitized raw material film after the stepof graphitizing, wherein the graphitized raw material film ispressurized together with a film-like medium other than the graphitizedraw material film in the post-planar pressurization step.
 2. The processfor producing a graphite film according to claim 1, wherein the rawmaterial film is retained in and in contact with a container that can bedirectly electrified by application of voltage and graphitized whileelectrifying the container by application of voltage in thegraphitization step.
 3. The process for producing a graphite filmaccording to claim 2, wherein the container that can be directlyelectrified by application of voltage is a graphite container.
 4. Theprocess for producing a graphite film according to claim 3, wherein thegraphitization step is carried out with carbon powder packed between thegraphite container and the raw material film and/or around the outerperiphery of the graphite container.
 5. The process for producing agraphite film 1 according to claim 1, wherein the graphitization stepincludes thermal treatment at a temperature of 2,000° C. or more.
 6. Theprocess for producing a graphite film according to claim 1, wherein thecarbonized polymer film is obtained by a carbonization step of thermallytreating a polymer film at a temperature of 600 to 1,800° C.
 7. Theprocess for producing a graphite film according to claim 1, wherein thegraphitization step is carried out in the state where the two or moreraw material films are stacked.
 8. The process for producing a graphitefilm according to claim 7, wherein the number of the stacked films isten or more in the state where the two or more raw material films arestacked.
 9. The process for producing a graphite film according to claim7, wherein the graphitization step is carried out in the state where thetwo or more raw material films are stacked and a carbon material havinga height smaller than the height of the stacked films is present aroundthe stacked films.
 10. The process for producing a graphite filmaccording to claim 1, wherein the pressurization is carried out bysingle-plate press in the post-planar pressurization step.
 11. Theprocess for producing a graphite film according to claim 1, wherein thepressurization is carried out by vacuum press in the post-planarpressurization step.
 12. The process for producing a graphite filmaccording to claim 1, wherein the multiple graphitized raw materialfilms are simultaneously pressurized in the postplanar pressurizationstep.
 13. The process for producing a graphite film according to claim12, further comprising an independent recovery step of recovering themultiple graphitized raw material films planarly pressurized asindependent graphite films after the post-planar pressurization step.14. A process for producing a graphite film comprising the step ofgraphitizing a raw material film made of a polymer film and/or acarbonized polymer film and a post-planar pressurization step forplanarly pressurizing the graphitized raw material film after the stepof graphitizing, wherein the multiple graphitized raw material films aresimultaneously pressurized in the post-planar pressurization step, andthe process further comprising the independent recovery step ofrecovering the multiple graphitized raw material films planarlypressurized as independent graphite films after the post-planarpressurization step.
 15. The process for producing a graphite filmaccording to claim 14, wherein the raw material film is 3 retained inand in contact with a container that can be directly electrified byapplication of voltage and graphitized while electrifying the containerby application of voltage in the graphitization step.
 16. The processfor producing a graphite film according to claim 15, wherein thecontainer that can be directly electrified by application of voltage isa graphite container.
 17. The process for producing a graphite filmaccording to claim 16, wherein the graphitization step is carried outwith carbon powder packed between the graphite container and the rawmaterial film and/or around the outer periphery of the graphitecontainer.
 18. The process for producing a graphite film according toclaim 14, wherein the graphitization step includes thermal treatment ata temperature of 2,000 degree C. or more.
 19. The process for producinga graphite film according to claim 14, wherein the carbonized polymerfilm is obtained by a carbonization step of thermally treating a polymerfilm at a temperature of 600 to 1,800° C.
 20. The process for producinga graphite film according to claim 14, wherein the graphitization stepis carried out in the state where the two or more raw material films arestacked.
 21. The process for producing a graphite film according toclaim 20, wherein the number of the stacked films is ten or more in thestate where the two or more raw material films are stacked.
 22. Theprocess for producing a graphite film according to claim 20, wherein thegraphitization step is carried out in the state where the two or moreraw material films are stacked and a carbon material having a heightsmaller than the height of the stacked films is present around thestacked films.
 23. The process for producing a graphite film accordingto claim 14, wherein the pressurization is carried out by single-platepress in the post-planar pressurization step.
 24. The process forproducing a graphite film according to claim 14, wherein thepressurization is carried out by vacuum press in the post-planarpressurization step.
 25. The process for producing a graphite filmaccording to claim 14, wherein the graphitized raw material film ispressurized together with a film-like medium other than the graphitizedraw material film in the post-planar. pressurization step.